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Abrasives in CMP Slurry


Primary and secondary particles in undiluted slurry


• Composition • Shape • Size/shape distribution • Aggregation state • Surface


Rotating Had Water (upside down)


CMP Slurry Polishing Pad


APPLICATIONS: Electronics Down Force


Dried on copper grid


Frozen in Cryo-TEM grid


In liquid phase in K-Kit * scale bar is 50nm


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