MATERIALS | TECHNOLOGY ELECTRONICS


Photosensitive film for semiconductor packaging


Asahi Kasei has combined the features of its photo- sensitive polyimide (PSPI) and dry film photoresist (DFR) into a new photo- sensitive film for semicon- ductor packaging. The PSPI film is under customer evaluation, with commercial availability expected soon. The new PSPI film combines Asahi Kasei’s expertise in making Pimel liquid PSPI used for buffer coatings and passivation layers and Sunfort dry film photoresist for temporary lithographic circuit patterning on substrates and wafers. It will improve productivity in semicon- ductor packaging manu- facturing by enabling easy, uniform application of a lamination process to large square panels, says the company.


PACKAGING Blister packaging for nutraceutical products


IMA recently showcased Suedpack Medica’s recyclable Nutriguard blister packaging concept for nutraceuticals at the Vitafoods event in Barcelona, Spain. The PP-based primary packaging


for products sold in tablet or capsule form already meets PPWR require- ments in terms of packaging design and recyclability. Nutri-Guard combines a weight of 375 g/m² with mono-material design, allowing it to be fed into existing PP recycling streams. In addition, Suedpack Medica already offers the films with a


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PIR content of more than 10%, sourced from in-house mechanical recycling operations. PP also offers a better carbon footprint than conventional packaging solutions based on PVC/PVdC + aluminium or PET, it says. The blister’s top and bottom


webs are halogen-free and phthalate-free,


IMAGE: SÜDPACK


comply with EU 10/2011 and so are approved for food packaging. It also has good printability with GIO-com- pliant inks suitable for food-contact applications. Optimal packaging results and maximum product protection are also ensured by the stable thermoforming and shrink properties of these perfectly matched high-performance films, together with their wide sealing range. In a live demonstration at the show, visitors saw the product being produced on IMA’s TR 135. � www.suedpack-medica.com


May/June 2026 | FILM & SHEET EXTRUSION 41 MEDICAL


Recyced PET used in medical


In addition, the film is designed to accommodate an increased number of insulating layers. The PSPI film is expected to be applied to redistribution layers for semiconductor packaging and insulating layers for package sub- strates.


By combining the new film with the Sunfort TA series, both fine circuit patterns and insulating resin layers can be formed by film lamination. Asahi Kasei is also developing solutions


that combine the PSPI film with the SUNFORTTM CX series, enabling the forma- tion of high-aspect-ratio copper pillars required for three-dimensional semicon- ductor packaging. “As the performance of AI semiconductors improves, advanced semiconductor packaging requires mount- ing technologies that cover larger areas and offer higher precision,” said Nobuko Uetake, senior executive officer at Asahi Kasei. � www.asahi-kasei.com


Medipack of Switzerland is using Eastar 6763 Renew from Eastman to create more sustainable medical packaging. The material is a key component in Medipack’s new MedPETG 6763 RN thermoforming sheet. Using it allows the com- pany to offer packaging that performs like its legacy wrap but with a lower environmental footprint. Medipack has long used Eastar 6763 in its production process but wanted to offer a more sustainable option. The company turned to Eastar 6763 Renew because it’s made with up to 50% certified recycled content* from hard-to-recycle waste materials processed through Eastman molecu- lar recycling. � www.eastman.com


IMAGE: ASAHI KASEI


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