search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
NEWS


More big names join Essen compounding exhibition


Evonik, Merck and Wacker are among the latest polymer and additive suppliers to book stands at the Compounding World Expo, which will take place at Messe Essen in Germany on 27-28 June 2018. More than 93% of stands have now been taken at the exhibition, which is being organ- ised by AMI and Compounding World magazine. “We are delighted that more than 135 companies from around the world have already signed up to exhibit at the first Compounding World Expo,” said Matt Wherlock, AMI’s exhibition sales manager. “Visitors to the event will be guaranteed to meet an impres- sive array of leading suppliers of polymers, additives, compounds, machinery, equipment and related services,” he added. Other companies that have booked


Orion, Polyplastic Compounds, Reverté, Schenck, Solvay, Unipetrol, Velox, Zeppelin and many more.


Admission to the Compound-


Essen’s Compounding World Expo will bring together more than 135 global exhibitors


stands include Azo, BASF, Bekaert, Biesterfeld, Borealis, Brabender, Brenntag, Buss, Campine, Coperion, Dow Corning, Econ, Elix, Farrel Pomini, Fraunhofer, HPF, ICMA Saint Giorgio, Imerys, IMI Fabi, JSW, Kaneka, Krauss- Maffei Berstorff, Leistritz, LKAB, Maag, MCC, Mitsui, Mixaco, Mondo Minerals, Motan Colortronic, MPI Chemie, Omya,


€1,800 for a 6m2


ing World Expo and its confer- ences and seminars is free of charge. Click HERE to register for your free ticket. Exhibition packages start at shell-scheme space


https://compoundingworldexpo.eventkit.live/register


(only three left) and this includes unlimited exhibitor passes and extensive marketing support. For details, contact Matt Wherlock at


matthew.wherlock@ami.international or call +44 117 314 8122. A full list of current exhibitors, plus the complete programme of training seminars, business debates and technical presentations across two conference theatres can be found at: � https://compoundingworldexpo.com/eu/


NASA to put 3D PEKK in space


Additive manufacturing firm Stratasys and Phoenix Analysis & Design Technolo- gies, an engineering services company, have joined with Lockheed Martin Space to deliver 3D printed


parts for NASA. The project will use the newly launched Stratasys Antero 800NA PEKK resin to produce six 3D-printed components that lock together to form a ring used


in a critical component on Orion’s docking hatch (pictured). A special electro- static dissipative Antero grade will be used. Other parts will be produced in the company’s Ultem 9085 resin. Orion is NASA’s deep- space spacecraft, for which two missions are currently planned. The first will be unmanned and will travel beyond the moon, while the second will have astronauts on board and will travel close to the moon in preparation for more complex future missions. The mission will have more than 100 3D-printed production parts on board. � www.stratasys.com


6 COMPOUNDING WORLD | May 2018


Chinese firm invests in Georgia


Top Polymer Enterprise, a Chinese manufacturer of thermoplastic elastomer (TPEs), is to build a $15m facility at Social Circle, in Georgia in the US. It will be its first US facility and the initial phase will cover 5,575m2


and inlcude three


compounding lines. Top Polymer has two


production bases in China, at Dongguan in Guang- dong province, and Liyang in Jiangsu province. It exports to more than 30 countries and regions. � www.topolymer.com


www.compoundingworld.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88