ADDITIVES | THERMALLY CONDUCTIVE
“The compounds are specifically designed with additional properties depending on their area of use which benefit the respective applications,” says Application Development Expert Christof Boden. One highlight is a new PA6 that combines high thermal conductivity with high reflectivity, flame retardancy, and tracking resistance. Thermal conductivity is direction-dependent due to the mineral filler particles; in the flow direction it is 2.5 W/m.K. The trial product is halogen-free flame retarded, offering a UL94 V-0 rating at 0.75mm. It also achieves the best possible classification (0.75mm) in the GWFI (Glow Wire Flammability Index) test at 960 °C. CTI (Comparative Tracking Index) is 600V. Lanxess says that TC compounds do not need to
Above: Graphene
developers see the material having
potential in compounds requiring improved thermal
conductivity
product or component to achieve more robust and reliable polymer products, suitable for more challenging environments. The first Carbodeon/Tiamet 3D filaments will be
PLA (polylactic acid) based, with further development focused on higher-performance thermoplastics. Carbodeon’s uDiamond filler material combines a small amount of diamond with boron nitride or alumina. The additive is claimed to provide gains in thermal conductivity of 100% or more without compromising electrical or mechanical properties. The performance improvement is attributed to the high thermal conductivity of the diamond material (more than 2,000 W/m.K), the small particle size and the active surface chemistry.
Compound options Major suppliers of thermally conductive com- pounds are using the benefits of additive advances to extend their portfolios. Lanxess, for example, is adding to its Durethan TC polyamide product line.
provide the levels of thermal conductivity offered by metals to be effective in heat sink applications. Given an appropriate design, even a slight increase can be enough to prevent heat accumulating in a part and damaging sensitive electronics. The company says that, as thermal conductivity increas- es, the role of convection in heat sink operation becomes more significant (Figure 10, page 30). Darin Grinsteinner, a Product Developer at
Celanese Engineered Materials, discussed a new addition to the company’s CoolPoly range, a toughened PA6 called CoolPoly E3629 for heat sinks, brackets and housings, at the Conductive Plastics conference in the US. Toughness is said to be twice as high as the existing grade and it has added UV stability for outdoor use, but thermal conductivity remains the same (Figure 11, page 30). Also speaking at the Conductive Plastics
conference, Covestro Principal Engineer/FTR Manager Terry Davis explained how an integrated LED lamp concept incorporating components in TC
Figure 8: Thermal conductivity of PA6 containing avanThermal Conductive770 at different loadings Source: Avanzare Innovacion Tecnologica
28 COMPOUNDING WORLD | April 2018
Figure 9: Thermal conductivity of PEEK containing avanThermal Conductive770 at different loadings Source: Avanzare Innovacion Tecnologica
www.compoundingworld.com
PHOTO: SHUTTERSTOCK
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