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September, 2017 ApexFA Merges SMT Printing and SPI


Lanham, MD — Apex Factory Auto - mation (ApexFA) has developed an


SMT printer with full 3D SPI. The SJ Inno Tech HP-520SPI printer is,


reportedly, the only printer on the market with this capability. It offers auto-correction feedback to the print- ing system, with no impact on cycle time, in a single, compact machine. Features of the system include:


Find Electronic Failures with Vibration Testing


Benchtop Vibration Table


   


     


3D solder paste inspection for the full PCB with auto feedback; 2D solder paste inspection; a three-stage con- veyor with automatic width adjust- ment; closed-loop, programmable squee gee pressure system; top link/ edge clamping system with robust 4.5 in. (11.43 cm) wide rails; a durable machine frame; and intu- itive, easy-to-use software. The system merges SPI and


printing in order to eliminate the need for a separate, standalone inspection machine. This lowers costs and saves space, since the printer, conveyor and separate SPI unit are all incorporated into a single unit. Also, there is no extra cost for software or any hassle getting an external SPI unit to com- municate with and provide feedback to the printer. The machine has three major


system options available: a solder paste dispensing system, dot dis- pensing system and an expanded traceability system. To maintain a uniform quantity of solder paste on the stencil, the production tech has to monitor the quantity of solder


paste and load it manually. Using an auto solder paste dispenser, this operation can be eliminated. The sol- der paste dispenser includes a paste height detector to initiate dispens- ing, ensuring consistent roll height and paste deposition on the board. The dot dispensing system can


dispense two different types of materi- al and includes a laser PCB height sensor. Fiducial marks and dispense coordinates can be taught by using its camera teach feature. It also includes a nozzle touch sensor and purge area. The system reads barcodes from


the paste, squeegee and stencil, ensur- ing that a particular job is properly set up. The additional traceability option is available to read barcodes on the PCB and document all the pertinent data for each individual board. Up to 0.3 x 0.3 in. (7 x 7 mm) 2D barcode labels on the PCB can be read by the printer’s camera system. ApexFA’s highly-scalable solu-


tions include a comprehensive range of Mirae pick-and-place machines, SJ Inno Tech printers, and XAVIS X-ray systems.


Contact: Apex Factory


Automation, 4221 Forbes Boulevard, Lanham, MD 20706 %888-323-4555 E-mail: inform@apexfa.com Web: www.apexfa.com


See at SMTAI, Booth 1231


TopLine: NewMicro-Coil Spring Positioning Tool


Contact us for more info.


Cincinnati Sub-Zero Cincinnati, OH


www.cszi Page 1ndustrial.com ORISSA FUSION


High speed, in-line, multi-platform selective soldering system


Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.


FEATURES: Available in 2, 3 and 4 station configurations Up to 457mm x 1115mm PCB handling capability* DC servo drives with encoders on X, Y and Z axis Solder wave height measurement and correction Automatic solder wire feed and level detect Process viewing camera(s) *Configuration dependent


OPTIONS: Ultrasonic fluxing Top-side and bottom-side instant IR preheat Laser PCB warp correction 1.5mm micro nozzle Large board handling


See the Pillarhouse selective solder range at SMTAI 2017 Booth #923


See at SMTAI, Booth 923 Pillarhouse INTERNA TIONAL


Pillarhouse International Ltd. www.pillarhouse.co.uk Tel: +44 (0) 1245 491333 Email: sales@pillarhouse.co.uk


Pillarhouse USA, Inc. www.pillarhouseusa.com Tel: +1 847 593 9080 Email: sales@pillarhouseusa.com


Pillarhouse (Suzhou) Soldering Systems Co., Ltd. www.pillarhouse.cn Tel: +86 512 6586 0460 Email: sales@pillarhouse.cn


Pillarhouse... Expect innovation


Graphite tool for positioning micro-coil springs.


procedure is simple: an operator places the LGA inside the graphite tool. Next, a layer of solder paste is printed onto the LGA pads using a 125 µm thick stainless-steel stencil. Afterward, micro-coil springs are dropped in place using TopLine’s patented Flip-Pack® cassette. After depositing the springs into


the graphite tool, the operator re - moves the Flip-Pack. The next step is to place the graphite into a vapor- phase reflow oven to form solder fillets that permanently secure the micro- coil springs to the IC substrate. After cool-down, the CGA is gently removed


using an engineered extraction tool. Contact: TopLine Corp., 95


Highway 22 W, Milledgeville, GA 31061 % 800-776-9888 E-mail: sales@topline.tv Web: www.topline.tv


(p) 513-772-8810


Irvine, CA — TopLine has introduced a new, patent-pending graphite tool for the precision positioning of 0.4 mm (0.02 in.) diameter micro-coil springs onto BGA1738 organic sub- strates. Micro-coil springs, an alter- native to conventional solder balls, provide compliant interconnects between IC packages and PCBs. The footprint of 1738 packages


is 42.5 x 42.5 mm (1.7 x 1.7 in.) with a pad pitch of 1.0 mm (0.04 in.). After


attaching micro-coil springs, the reworked package is better suited to handle stress caused by CTE mis- match and has increased reliability under harsh operating conditions. The tool locks organic or ceram-


ic LGA substrates in place while micro-coil springs are attached. The


NEW NE


NEW EW


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