This page contains a Flash digital edition of a book.
Page 46


www.us-tech.com


August, 2017


Breaking Records: Koh Young Delivers 10,000th Inspection System By Jenny Yuh, Marketing Assistant, Koh Young Technology K


oh Young Technology, one of the fastest-growing 3D inspec- tion systems providers world-


wide, recently delivered its 10,000th inspection system, a Zenith AOI machine, to a large Chinese automo- tive supplier. The Zenith system is designed to measure the true profilo- metric shape of components, solder joints, patterns, and even foreign materials on assembled PCBs, using eight-way projection. Marking the order milestone,


Dr. Kwangill Koh, CEO of Koh Young Technology, said, “We are very pleased to celebrate this occa- sion. To our team, delivering 10,000 machines is indeed a remarkable achievement. It has been a challenge, and also a great success, because Koh Young is the first inspection company in the SMT industry to break this sales record. But it doesn’t end here; 10,000 deliveries is just the beginning as we continue to help SMT PCB manufacturers around the world build a better process.”


Technological Achievements Koh Young attributes its tech-


nological achievements and its large number of machine deliveries to an entirely collective, company-wide effort. Beginning with the first 3D SPI system in 2004, and followed by another groundbreaking achieve- ment, 3D AOI, in 2010, the company


“It has been a challenge, and also a great success, because Koh Young is the first inspection company in the SMT industry to break this sales record.”


is recognized as a pioneer of inspec- tion and measurement technology. The company has not only


helped to shift the prevailing indus- try paradigm from 2D to 3D inspec- tion technology, but has also signifi- cantly improved the standard for inspection conditions. Koh Young’s Zenith 3D AOI, shows accurate


Zenith 3D AOI systems at Koh Young’s production facility in Seoul, South Korea.


which allows manufacturers to imple- ment Industry 4.0 with reliable, fully- 3D measurement data. All the inspection results from


Koh Young 3D SPI and AOI systems are stored in a central server, which is then processed for analysis by the KSMART engine. Factory managers can track root causes of defect issues by looking up a real-time SPC chart. They also have the freedom to apply changes to inspection programs in real time. LM@KSMART (“LM” for Li -


brary Manager) stores job files and inspection conditions in a centralized database. Stored job files can be dis- tributed to the company’s 3D SPI and AOI systems for efficient pro- gram management. OLD (off-line


the link, users can adjust their print- ing process parameters based on 3D measurements, not only to detect defects, but also to prevent them, thus maximizing operational effi- ciency and reducing false calls.


Paving the Way to Industry 4.0 Koh Young’s vision of the smart


technological future includes other newly-developed features, such as automated programming. With KSMART technology forming a back- bone, the new software recommends suitable metadata and provides opti- mal options for each component from the library manager. These sort of prescriptive ana-


lytics can eliminate much of the has- sle of multiple fine tunings, and also


measured dimensions of solder joints and compares those data with IPC- 610 standards. Such a quantitative approach enables standardized and objective process control. The company has recently


focused on helping its customers real- ize their smart factory visions with its latest software innovation, KSMART. The KSMART solution is a measure- ment-based process analysis solution,


debugging) @KSMART helps the user to verify new suitable conditions from the library manager for every component, and then to deploy them to all machines without halting pro- duction.


Also, the company’s 3D data-


based SPI-AOI communication solu- tions, Link@KSMART, reviews, diag- noses and optimizes printing, pick- and-place and reflow processes. With


remove human errors when carrying out tolerance settings. Through machine-learning algorithms, pow- ered by Koh Young’s intelligent plat- form (IP), process optimization becomes more fluid, without human interaction. The software also aids in process management by using effi- cient machine-to-machine (M2M) communication — for example, allow- ing the SPI system to tell the printer when calibration is needed. Koh Young is accelerating its


vision by expanding R&D centers worldwide in order to facilitate the development of a proprietary AI plat- form. In 2016, the company estab- lished three additional research and development centers that contributed to a large increase in technological competitiveness and core solutions. In the U.S., Koh Young Re -


search America, based in San Diego, California, is building the foundation for the company’s AI (artificial intel- ligence) business platform. Koh Young’s electronics manufacturing lab, located on the SUNY Bing - hamton University campus is devel- oping fundamentally new methods of smart electronics manufacturing. Meanwhile, in Korea, the company closely collaborates with Korea Advanced Institute of Science and Technology (KAIST) to create cut- ting-edge solutions.


Koh Young and KAIST will con-


tinue to strengthen the foundation of the AI platform for 3D data-based SMT process control systems — with the goal of ultimately enabling the intelligent factory. The company also expects that its AI platform will find broader application outside of SMT and manufacturing. Such an AI plat- form will allow interconnected machines to not only communicate, but to make decisions and to opti- mize overall production as a group,


creating a truly smart factory. Contact: Koh Young America,


Inc., 6150 W Chandler Boulevard, Suite 39, Chandler, AZ 85226 % 480-403-5000 fax: 480-403-5001 E-mail: america@kohyoung.com Web: www.kohyoung.com r


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84