August, 2017
www.us-tech.com
IPTE Depanelers Cut Both Aluminum and FR4
Alpharetta, GA — IPTE depanelers (routers) can now be used to cut ei- ther FR4 or aluminum. Many of today’s LED applica-
tions use aluminum for heat sinks and as a carrier for the circuit and are built on multi-panel PCBs that must be separated. The IPTE FlexRouter II has
been upgraded to rout such alu- minum panels. The separated PCB can be delivered to a conveyor or to trays. Options include an edge-clean- ing unit and a vision system to check
the cut quality and dimensions. Changeover from aluminum
cutting to FR4 cutting and vice versa takes less than a minute. The system uses standard router solutions and special algorithms to adapt the de- paneling process, optimizing cutting speed and router bit lifetime. The FlexRouter II is a small-
footprint, customizable depaneler. The company also recently intro- duced a uniform and intuitive ma- chine software environment for its router systems. The system is de-
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signed for mid- to high-volume pro- duction environments that have a wide variety of PCBs. Features include: low-stress de-
paneling; high-speed linear motors; flexible servo and pneumatic grip- pers; bottom-side routing and top- side gripper; and individual out-feed
handling of the separated boards. Contact: IPTE USA, 5935 Shiloh
Road East, Suite 100, Alpharetta, GA 30005 % 678-807-0067 fax: 678- 807-0072 E-mail:
sales@ipte.net Web:
www.ipte.com
FlexRouter II depaneling system.
Indium Showcases AuGe Solder Preforms
Clinton, NY — Indium Corporation recently displayed its semiconductor- grade, gold-germanium (AuGe) sol- der preforms at IMAPS High Tem- perature Electronics Network 2017 (HiTEN 2017), held from July 10-12 in Cambridge, U.K. The preforms are designed to meet the challenges of RF and power semiconductor devices as they continue to get smaller. The company’s high-melting-
point AuGe solder preforms perform well at the elevated operating temper- atures of smaller dice with increased power densities. In addition, improve-
Gold-germanium solder preforms.
ments in wetting make semiconduc- tor-grade AuGe solder preforms criti- cal for void reduction efforts. Gold-based solders have a melt-
ing point ranging from 280 to 1,064°C (536 to 1,947°F), making them compatible with subsequent re- flow processes. Gold-based solders are resistant to corrosion, provide su- perior thermal fatigue resistance and exhibit excellent joint strength. Indium’s lead-free and RoHS-
compliant preforms are available in a variety of standard and custom-engi-
neered designs. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
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