SECTION TITLE


INSTRUMENTATION • ELECTRONICS


Innovations in HDI technology are facilitating the design of smaller PCBs


MIMOVINGNIATURE


As the electronics sector demands ever smaller components, Jan Pederson looks at how this is affecting the design of printed circuit boards


T


oday’s electronics industry is characterised by a strong miniaturisation trend. Components are getting smaller and smaller, which


also places new demands of the design of the printed circuit boards (PCBs) they are mounted on. NCAB Group is committed to global standards association IPC’s work to develop standards for ultra-dense Ultra


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HDI PCBs, and will be in a position to deliver them to customers this year.


EMERGING TECHNOLOGIES IN PCBS At present, there are several emerging innovations and technologies within the design and manufacture of PCBs. Te first is High-Density interconnect (HDI) technology, which allows for


higher component density and improved performance in smaller form factors. Another area of innovation is flexible PCBs used in flexible and wearable electronics, where improved durability and form factor are matters of interest. Additionally, microvias - used as the


interconnects between layers in HDIs and PCBs - are gaining interest in the sector,


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