Advertorials
Astute Electronics signs LEMO, adding rugged, high density, IP rated connector families to growing franchise portfolio
‘perfect match for Astute’s defence and hi-rel customer base’
Astute Electronics, the leading supplier of electronic components and value added services, has signed a franchise agreement with LEMO, the renowned Swiss manufacturer of precision connectors used in a variety of challenging application environments.
“We are delighted to add LEMO to our growing portfolio of electromechanical suppliers”, commented divisional manager, Gary Evans. “Products such as the company’s M series, the smallest multi- pin, full shielded, vibration-secure and sealed connector available, offering a lightweight connection with high pin-count density, 3600 EMC shielding protection, the lightweight, high temperature F series targeting the defence, autosport and other harsh markets, and the T series, an update of LEMO’s staple B series with a higher contact density and IP68 rating, will be of great benefit to our customer base.”
Also of interest to Astute’s defence business is LEMO’s recently announced new NiCorAl surface treatment. This finish is a specially formulated Nickel Teflon finish in Anthracite dark grey colour and has been developed particularly for the aluminium alloy bodied M Series ratchet coupling range of connectors which are proving to be an excellent and significantly smaller alternative to MIL 38999 connectors. Fully tested according to AECTP 300 / MIL-STD-810 / MIL-STD-202 standards the aluminium bodied M Series have passed the 500 hour salt spray test target and the brass bodied M series have achieved 1000+ hours. The new finish satisfies the requirements of both RoSH2 and the forthcoming REACH 2017 regulations.
Astute Electronics Tel: 01920 897594
www.astute.co.uk
Lattice Announces First Programmable ASSP (pASSP)
Interface Bridge for Mobile Image Sensors and Displays Low Cost Video Interface Bridge with the Highest Bandwidth, Lowest Power and Smallest Footprint
Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced the industry’s first Lattice CrossLink™ programmable bridging device that supports leading protocols for mobile image sensors and displays. Systems with embedded cameras and displays often do not have the right type or number of interfaces, which can be resolved using a bridge. The new CrossLink device combines the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP to create a new product class called programmable ASSP (pASSP™). As the first product in this category, the CrossLink device is a low cost video interface bridge with the highest bandwidth, lowest power and smallest footprint. This makes it the optimal solution for virtual reality headsets, drones, smartphones, tablets, cameras, wearable devices and human machine interfaces (HMIs).
The CrossLink device’s features include: • World’s fastest MIPI® D-PHY bridging device that delivers up to 4K UHD resolution at 12 Gbps bandwidth.
• Supports popular mobile, camera, display and legacy interfaces such as MIPI D-PHY, MIPI CSI-2, MIPI DSI, MIPI DPI, CMOS, and SubLVDS, LVDS and more. • Industry’s smallest package size with a 6 mm2 option. • Lowest power programmable bridging solution in active mode. • Built-in sleep mode. • Takes the strongest features from ASSPs and FPGAs to deliver the best solution of both worlds.
Lattice Semiconductor Corporation
www.latticesemi.com
OMC’s backlights now available with
sunlight-visibility layer Enables portable instrumentation to be used outdoors
OMC, the pioneer in optoelectronics, today announced that its ProfiLED coloured LED backlights are available with a proprietary active backing layer that enables them to be viewed in much brighter ambient lighting conditions. This is especially relevant for makers of portable instrumentation which is used outdoors.
Complementing a standard product range which numbers over 250 different sizes, OMC can turn around bespoke-shaped ProfiLED backlights is as little as five working days with little or no setup costs. The company claims that this is often the only viable option for small to medium volume (fewer than 10,000 pieces) requirements. The high-visibility option – termed Royale Reflector – incorporates an active backing layer in the backlight’s back reflector, which enhances contrast in high ambient lighting conditions, ensuring that the display remains visible.
The same technology can be used to reduce the power required, as the LED emitters need to do less work to adequately illuminate the display. The technology is available in all of OMC’s red, yellow, orange and green ProfiLED backlights.
OMC Tel: 01209-215424
www.omc-uk.com
Hi-Rel industries shift to jackscrew fixings for
ultimate connection security Robotics, Satellites & Motor Sport applications all benefit from Harwin’s Datamate J-Tek in high shock and vibration environments
Harwin, the leading hi-rel connector and SMT board hardware manufacturer, has announced that several industries - satellites, robotics, motor sport – are now preferring to specify the company’s 2mm pitch Datamate family of high reliability connectors with jackscrews, rather than latches or other fixing mechanisms, to ensure secure connection. As well as guaranteeing connector retention and signal integrity, the J-Tek jackscrew fixing is also being used to connect PCBs together in innovative configurations where space is at a premium.
Comments Scott Flower, Harwin’s Global Product Manager for High Reliability Connectors: “As electronics becomes pervasive in harsh environments where high
levels of shock and vibration are experienced, customers are demanding fixing solutions that provide the highest confidence levels. Autosport teams, for example, that used to use plastic latches are now moving over to jackscrews for added security. Robotics is another example where repeated mating can lead to the latch wearing, so jackscrews are now commonly preferred.”
Satellites, especially miniature CubeSats, are relying on jackscrews not only to ensure that the connection survives harsh operation conditions, but also to save space.
Harwin Tel: 02392 314 532
www.harwin.com
Mouser launches MultiSIM BLUE Premium and raises the bar with enhanced design flexibility and
more robust features Mouser Electronics, Inc. has announced the global release of MultiSIM BLUE Premium, the newest release of the award-winning MultiSIM BLUE — the Mouser Edition of the NI Multisim circuit design tool. MultiSIM BLUE Premium takes the MultiSIM BLUE design tool’s ability to scheme, simulate, PCB design, BOM export and purchase, and boosts it to a new level of refreshingly unlimited flexibility and functionality.
MultiSIM BLUE Premium, powered by National Instruments (NI), offers unlimited components
within the schematic and integrated design capabilities. The new advanced tool provides engineers with a simulation environment using Mouser's vast selection of products and a larger selection of NI components, including the newest in analog and mixed-signal ICs, passive components, discrete semiconductors, power management ICs, connectors, and electromechanical components.
Featuring an industry-standard Berkley SPICE simulation environment of electronic circuits, MultiSIM BLUE Premium provides engineers with the freedom to design and simulate circuits before laying them out in physical prototypes. Engineers can now visualize and evaluate linear performance, making this critical step of circuit design easier, faster and far more productive.
Mouser Electronics
www.mouser.com
Panasonic releases improved 2nd generation
of Grid-EYE Infrared Array Sensors Lower NETD, High accuracy and increased detection distance
Panasonic Automotive & Industrial Systems Europe has released the much improved and accurate second generation of its Grid- EYE infrared array sensors. The new high gain types (AMG8833 and AMG8834) and low gain types (AMG8853 and AMG8854) of Grid-EYE 2nd Generation now benefit from an improved NETD (Noise Equivalent Temperature Difference) of 0.16°C at 10Hz and of 0.05°C at 1 Hz. For all Grid-EYE 2nd Generation models the detection distance has improved from 5m up to 7m. It is important to note that the second generation of Grid-EYE sensors is fully compatible with the existing first generation designs. This means that the engineers can now get improved and accurate results when they use the sensor in their applications. Panasonic is committed to improve the customer experience and provide much more application benefits with the improved MEMS technology.
Based on Panasonic’s MEMS (Micro Electro Mechanical Systems) technology the Grid-EYE 2nd Generation infrared array sensors combine a more sensitive MEMS sensor chip, a digital ASIC (I2C interface) and a silicon lens in the same small package. The parts feature 64 thermopile elements in an 8x8 grid format that detect absolute surface temperature without any contact. Unlike conventional sensors, Grid-EYE uses a patented 60° silicon lens etched out of a silicon wafer, which is (with less than 0.3mm height) the smallest available lens in the market. The combination of these technologies allows for a sensor package size of only 11.6mm x 8mm x 4.3mm, which is around 70% smaller in size than competitor products.
For more information on the new Grid-EYE 2nd Generation sensors from Panasonic please visit:
https://eu.industrial.panasonic.com/products/sensors-optical-devices/ sensors-automotive-and-industrial-applications/infrared-array
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