Front End I News
New iCE40 UltraPlus devices from Lattice Semiconductor accelerate customer innovation in smartphones and IoT edge devices
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attice Semiconductor Corporation, the leading provider of customisable smart connectivity solutions, has announced its new iCE40 UltraPlus FPGA devices, one of the industry’s most energy-efficient and programmable mobile heterogeneous computing (MHC) solutions. This latest addition to the iCE40 Ultra family delivers eight times more memory (1.1 Mbit RAM), twice the digital signal processors (8x DSPs), and improved I/Os over previous generations. Available in multiple package sizes, the programmable nature of the iCE40 UltraPlus device is ideal for smartphones, wearables, drones, 360 cameras, human- machine interfaces (HMIs) and industrial automation, as well as security and surveillance products.
Enabling a new way to interact with
electronic devices, the iCE40 UltraPlus device is well suited for voice recognition, gesture recognition, image recognition, haptics, graphics acceleration, signal aggregation, I3C bridging and more. This brings added intelligence to smartphones and IoT edge products, such as wearables and home audio assisted devices, to be always on, always listening and ready to
instantly process commands locally without going to the cloud.
The MHC paradigm is concentrated
around a highly energy-efficient method for computing algorithms quickly and locally using dissimilar processors to offload power hungry application processors (APs) in battery-powered devices. More DSPs offer the ability to compute higher-quality algorithms, while increased memory allows data to be buffered for longer low-power states. The flexible I/Os enable a more distributed heterogeneous processing architecture. This combination provides flexibility to enable OEMs and the Maker market to quickly deliver key innovations, such as always on sensor buffers and acoustic beam forming.
Imagine interacting with your mobile
product, but without ever touching it. The iCE40 UltraPlus device will enable the responsiveness required to deliver this functionality. “Distributed processing demands are
increasing in mobile applications and Lattice’s iCE40 UltraPlus is optimised to address these requirements. As the newest addition to our successful iCE40 Ultra product family, the iCE40 UltraPlus FPGAs
expand its market reach to system designers who require FPGA functionality with improved DSP compute power, more I/Os and increased memory for buffering,” said C.H. Chee, senior director of marketing, mobile and consumer division at Lattice Semiconductor. “Our solution will
reduce design complexity, system power consumption and time-to-market, while enhancing responsiveness of tomorrow’s mobile devices.”
www.latticesemi.com/ iCE40UltraFamily
LOPEC 2017 – Positive outlook amid a fast growing marketplace for printed electronics
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OPEC, the leading international event for everyone involved in the printed electronics industry, will take place in Munich, Germany, at the end of March 2017. The two-day exhibition (March 29-30) and three-day conference (March 28-30) will provide attendees and delegates with a great opportunity to keep right up to date with all the latest developments in this increasingly important and rapidly growing technology sector.
Huge industry growth predicted The global revenue for products using printed and organic electronics during 2016 is estimated to be 26.9 billion US dollars, an annual increase of 31.8 per cent since 2010. According to the consulting firm Smithers Apex, the market volume is predicted to grow to an estimated 43 billion US dollars by 2020 so, against this backdrop of
6 December 2016/January 2017
industry growth, the signs are good for LOPEC 2017. This exciting technology is already being used in applications across a large number of industries. In the medical sector, these include interactive devices and pharmaceutical packaging while in automotive, OLED tail lights and in consumer electronics, displays and sensors. “Interest in printed and organic
electronics continues to rise, as does the demand for products and solutions that leverage these technologies,” said Dr Peter Fischer, chief operating officer at Thin Film Electronics ASA. “Platforms such as LOPEC play a vital role in supporting innovation and fuelling business success. Thinfilm will be exhibiting again in 2017 and we look forward to strengthening existing relationships and uncovering new opportunities,” he added. LOPEC is unique in providing visitors
Components in Electronics
with the chance to see and discuss every aspect of printed electronics from the theory and practice behind this exciting technology to its application and the commercial potential made possible by its adoption. A large number of key industry players have already registered for the 2017 event, including Bosch Rexroth, Cambridge Display Technology, Coatema, Fujifilm Dimatix, DuPont, Kroenert, Merck, NovaCentrix, PolyIC, RK PrintCoat Instruments, Thieme, Schott and VTT.
The conference With around 200 presentations from 27 different countries, the LOPEC Conference is the world’s leading communication platform for research, information and solutions in the printed electronics industry. The conference presentations are tailored exactly to the interests of delegates with a business
biased programme focussing on business strategies, market analyses, and business models; a technology programme geared towards industry and applications; and a scientific conference where scientists can discuss the latest concepts and the results of their research.
The first keynote speakers for the plenary session have already been confirmed. Jean Yves Gomez from ISORG, France will discuss applications using optical sensors for medical technology while Sangyon Lee will focus on current activities at electronics group Samsung and the use of printed and organic electronics in South Korea. Jennifer Lin from AUO, Taiwan, will speak about printed transistors for flexible applications – particularly in displays.
www.lopec.com www.cieonline.co.uk
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