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Bottom terminated component (BTC) technology follows growing market demand for lower profile packaging
Bottom terminated component (BTC) technology follows growing market demand for lower profile packaging
flat, due to the nature of the resin used Other areas of interest for the the IPC 7093 will definitely serve an
and the dispensing process. Still, where technology include packaging MEMS important need by providing a focal point
the IC is to be over molded, this concern devices, RF and microwave and optical/ for understanding these important package
is obviated. However the company is photonic sensors such as UV EPROMs, types.
nevertheless looking at alternative methods CCDs or lasers. Given that many MEMS
which could fully ameliorate the issue. device application require access to the Verdant Electronics founder and president
Interconnection from side to side on outside world the high level of interest Joseph (Joe) Fjelstad has more than 35 years
the package is accomplished using filled reported seems sensible. of international experience in electronic
via in pad technology to connect from top Mirror Semiconductor president interconnection and packaging technology in
side to bottom side. The finished contact Martin Hart has indicated that the a variety of capacities from chemist to process
on the SMT side is all metal and flat, company is building a world wide network engineer and from international consultant
which eliminates normal concerns about of assembly houses to provide customers to CEO. Mr. Fjelstad is also a well known
void formation in via in pad designs. The with QFN open cavity packaging and author writing on the subject of electronic
surface finish for the surface mount lands assembly in multiple locations around the interconnection technologies. Prior to founding
is of the electroless nickel immersion gold globe. Verdant, Mr. Fjelstad co-founded SiliconPipe
(ENIG) type. In summary, the family of BTC a leader in the development of high speed
Reviewing the areas of interest is components continues to evolve and interconnection technologies. He was also
interesting in its own right. Following grow to meet the cost and performance formerly with Tessera Technologies, a global
are a few of the applications that are needs of electronic product designers and leader in chip-scale packaging, where he was
looking at open cavity technology in developers. These planar lead devices appointed to the first corporate fellowship for his
QFN format. One that is seemingly well are likely to see much increased use in innovations.
suited to the technology is that of test and the coming years as interconnection
prototype where typically the demand is technology itself continues to grow and
for small quantities (e.g. less than 500 evolve. One example of note, and pointed
pieces) The package structure is highly out in earlier columns, is as a packaging
amenable to getting a die into a package solution of first choice for Occam Process
and then being able to exercise and even assemblies where solder is replaced by
perform diagnostics because before the copper plated interconnections. Still
lid is applied, the die can still be seen and solder will likely have a long run ahead
accessed if desired. and having standards in place such as
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