This page contains a Flash digital edition of a book.
Interview
What really separates us from our competi- The other pastes to be debuted are both during this downturn, in the hopes that
tors is that we can offer the best water-sol- no-clean pastes, using FCT’s leading when the recovery happens we will be
uble flux medium with Nihon Superior’s technology. Can you give us a preview of ready to gain market share.
SN100C. what we can expect from these pastes?
What about solar—what materials do you
Our focus will be to develop a line of
The new pastes use FCT’s leading plan to market for PV applications?
halide-free solder pastes. With the no-clean
technology to achieve high-volume
products, our focus will be to develop a
repeatability with 16 mm pitch QFP pads
Our current technology in soldering
cosmetically appealing solder joint without
and 12 mm circles. How does this benefit
materials for the solar industry include
the end user?
sacrificing stability, open time and pin solder pastes, fluxes and solder ribbon.
testability. We will, of course, incorporate Our focus is on lead-free alloys, and we
We spend considerable time working on Nihon Superior’s SN100C, leveraging the will lead with Nihon Superior’s SN100C,
printability, not only with solder paste strength of the leading alloy on the market. which has a oustanding track record in the
but also on stencils, with our FINELINE assembly industry.
STENCIL division. Increasingly smaller When should we expect the last two
components can be a challenge to paste solder pastes from the new line-up to What other innovations should we expect
transfer, and working with FINELINE debut? from FCT Assembly over the next year?
STENCIL has helped us to develop both
We are working hard on this at the mo- We will work on our halide-free products
our new pastes and the new UltraSlic
ment and hope to have these products for pastes, fluxes and core solder. We also
stencil. When the UltraSlic stencil is com-
ready by the end of the third quarter of are working on some new products that we
bined with our WS159/WS177, customers
2009. hope will be ready by Productronica. These
are able to get good printing in the range
include tacky
of 0.45 surface area
fluxes, no-clean
ratio.
and water-soluble
The new water-
“Increasingly smaller components can be
BGA fluxes as well
soluble solder pastes,
as a new dispens-
WS159 and WS177,
a challenge to paste transfer.”
able solder paste.
both offer best-in-
Finally, we will
class solder spread
continue working
and wetting. How
with our water-
was this achieved?
soluble line to
develop a product
Our sister company is Florida CirTech,
that will not need to be refrigerated. In
Inc. They manufacture electroless Ni/im- In these difficult economic times,
pastes, stability and consistency will be our
mersion Au, immersion silver and lead-free most companies have put a hold on
focus.
hot air leveling. This gives us an advantage introducing new products. What drove
of understanding these surface finishes, FCT Assembly to create these new Thank you, Mike. We’re looking forward
which has led to some new developments formulations? to seeing what FCT Assembly brings to
in activation packages for our pastes. So Productronica next month.
For the past five years, we have spent
the synergy of FCT Assembly and Florida
significant time educating customers on
CirTech has paid off. We were able to take Trevor Galbraith.
SN100C. Now that this product is well
the knowledge of surface finishes from
known, we needed to get back to our
our sister company and apply this to the
strength: development. All our businesses
development of a new activation package
are technology based, and although we
for both water-soluble products.
are not as big as some, we need to lead.
Financially, we are strong enough to spend
Book Review: Printed Circuits Handbook 6th Edition, continued from page 32
Clearly the knowledge base has grown provides important information on the Coombs has laid out is followed. Finally, it
over the years. The first edition of the book most recent approaches to manufacturing is not possible to name all of the authors
comprised perhaps 16 chapters with 11 printed circuits that involve high density who have contributed to the book over time
authors; the current edition has 67 chapters interconnections which appears to be and do each of them the justice they deserve
(up by six from the prior edition) plus substrate of choice for many future projects. for writing efforts and individual careers,
an appendix of standards and a glossary In summary, Printed Circuits Handbook but it is safe to say that they represent
with 44 authors contributing to the effort. is in this writer’s opinion one of the the top of the top of industry talent and
One reason for the jump in chapter count most important books in the electronics especially in their fields of individual
between the most recent editions was the manufacturing industry and in many ways expertise. Clyde Coombs, the Printed Circuits
special emphasis given to lead-free solder, the standard by which other such books Handbook’s extraordinary editor, would have
which has caused the electronics industry must be measured. It will surely continue to it no other way.
significant challenges. The book also be so for as long as the formula that Clyde
www.globalsmt.net Global SMT & Packaging – September 2009 – 35
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60
Produced with Yudu - www.yudu.com