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Show preview: Productronica 2009
Technology preview:
What’s on the show floor?
Global SMT & Packaging magazine brings a preview of just
some of the innovations and new technology to be showcased
on the exhibition floor at Productronica2009.
license. i-SAC 387 solder features added
Productronica
cobalt (Co) to improve the alloy’s melting
November 10-13, 2009
characteristic. It also has added geranium
New Munich Trade Fair
(Ge), which which plays the role of antioxi-
dant, preferentially reacting with oxygen to
Centre, Munich, Germany
protect the solder from the oxidation that
productronica.com results in the formation of dross. i-SAC387
has a melting point of 217°C and a specific
gravity of 7.5 g/cm3. The company is also
demonstrating the tin/silver based i-SAC
105. www.balverzinn.com
BpM Microsystems—booth a2/377
BPM Microsystems will have its latest
Flashstream automated programming
aqueous Technologies—booth
technology on display in distributor PB
a2/559
Tec’s Stand. Designed specifically to solve
Aqueous Technologies’ Zero-Ion G3 clean-
excessive programming times in current
liness tester is designed to test electronics
in-system, JTAG and in-circuit program-
assemblies for ionic contamination. The
ming production methods, the 3000FS
Zero-Ion uses a dynamic technology that
tion at this year’s Productronica as it shows
is modeled from the current BPM 3710
provides automatic regeneration of the
True Capacity on Demand for its high-vol-
handler and contains four Flashstream pro-
machine’s test solution, maintaining a
ume A-Series, which can save equipment
gramming sites. Rated at 1100 devices per
high degree of test solution sensitivity. The
assemblers 20% of initial capital costs.
hour, the new 3000FS is flexible enough to
Zero-Ion also has been determined to be
Assembléon is also showcasing additions to
handle parts in tray, tube or tape for device
3.7 times more sensitive than the manual
its cost effective high-mix MC platform, in-
input or output. www.bpmmicro.com
resistivity of solvent extract (R.O.S.E.) test.
cluding the newly introduced MC-P screen
The Zero-Ion performs cleanliness tests au-
printer—the first screen printer under the
cyberOptics—booth a2/417
tomatically and is capable of storing 50 test
Assembléon brand. www.assembleon.com
Now able to accommodate boards/panels
parameters within its internal controller.
measuring 100 x 100 mm up to 810 x 610
www.aqueoustech.com
Balver Zinn—booth a4/570
The BALVER ZINN Group will demon-
mm, CyberOptics redefines inspection
speed with the new SE500X 100 percent
assembléon—booth a2/477
strate the new i-SAC series of optimized
3-D solder paste inspection system. This
Royal Philips Electronics subsidiary Assem-
alloyed lead-free solders based on the
system has the ability to inspect even the
bléon is stressing performance optimiza-
‘Iowa State Patent’, for which they hold a
40 – Global SMT & Packaging – October 2009 www.globalsmt.net
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