New Products
milliohm/square/mil. This economical ink
features excellent adhesion to polyester,
polyimide, polycarbonate, glass and a vari-
ety of other substrates. Unlike convention-
al conductive materials, CMI’s economical
silver conductive ink is very resistant to
flexing and creasing and highlights a lower
cost alternative to some of our standard
conductive inks. Applications include,
but are not limited, to RFID antennas,
EMI/RFI shielding, polymer thick film cir-
cuitry and membrane switches. 125-10 can
be applied by screen-printing and syringe
dispensing while other versions of 125-10
are available for flexographic, rotogravure,
stenciling and spraying processes.
based fluxes, improvement rates of more
www.creativematerials.com
than 90% have been reported by custom-
slow such that inspections must be done
ers. PacIFic 2009MLF works with leaded
off-line or handled slowly in-line, Omron’s
and lead-free alloys in wave-and selective
solution enables use of both technologies
soldering processes.
www.interflux.com
in the same inspection.
www.omron247.com
Staticide ESD Safety Shield is now
B2B® SMT connector reaches
available as an aerosol spray
new height
By customer demand,
The B2B® high density SMT connector
ACL Incorporated’s long-
line from Advanced Interconnections
lasting static dissipative
Corp. is now available in a 19.05 mm (.750
coating, Staticide ESD
inch) mated height. Designed for high pin
Safety Shield, is now avail-
count and high density 1.27 mm pitch
able as an aerosol spray.
board to board applications where durabil-
6500 Staticide ESD Safety
ity and reliability are critical, such as serv-
Poly-Form™ flexible adhesive Shield is a humidity-
ers and routers, the newest member of the
preforms
independent water-based
B2B® SMT Connector series is available
Multi-Seals, Inc., introduced an innovative
coating that provides a
in 8 and 10 row configurations from 240
alternative to liquid adhesive for com-
constant surface resistivity
to 500 positions.
ponent assembly. Multi-Seals F05 Poly-
of 106 ñ 109 ohms per
www.advanced.com
forms™ are flexible pre-shaped adhesives
square without washing
designed for bonding diverse materials,
off like anti-static topicals.
Javelin Design Automation & IMEC
including metals, plastics, ceramics, and
The advanced formula
extend design technology for 3D
glass. F05 has negligible vertical flow,
dries clear and can adhere
stacked ICs
which keeps the adhesive contained in
to a variety of surfaces in-
Javelin Design Automation introduced
precisely defined areas. The pre-shaped
cluding acrylic, polycarbonate, PETG, and
a revolutionary solution for the rapid
copolymer prevents drips and dispensing
glass. The coating is designed to be sprayed
design exploration and optimization of
inconsistencies typical of liquid adhesives.
on carrying trays, protective packaging, test
three dimensional stacked ICs (3D SIC).
Adhesive placement is highly consistent
equipment, PVC and vinyl tubing, and
Developed in close collaboration with
from bond to bond. The durability and
viewing ports to reduce tribo-charging and
IMEC, Europe’s leading independent
flexibility of F05 Poly-forms facilitates
dissipate static.
www.aclstaticide.com
nanoelectronics research center, and Qual-
manual and automated handling and
comm, a partner in IMEC’s 3D integration
increases production rates. F05 can be Omron shortens tact time for in-line
program, 3D PathFinding extends the
pre-shaped in multiform configurations to x-ray inspections with dual-mode
Javelin PathFinding methodology and j360
accommodate a broad range of applica- CT scanner
Silicon PathFinder™ platform to support
tions.
www.multi-seals.com Omron introduces a time-saving newx-
virtual chip design for co-optimization of
ray inspection system, VT-X series, that
system design and 3D interconnect-packag-
The elimination of solder balls in shortens the tact time for in-line, post-
ing technologies. Designers of 3D ICs are
selective soldering?
solder inspection of printed circuit boards.
now empowered to rapidly explore many
Almost every VOC-free flux used in a
The VT-X is the world’s first dual mode
potential 3D design implementations for
selective soldering process will gener-
x-ray inspection system that combines
their technical value propositions, and to
ate a lot of micro solder balls, especially
highly accurate computed tomography
identify and mitigate risks-benefits and
between through hole connector pins. The
(CT) scanning with high-speed ‘tomosyn-
optimize value.
www.javelin-da.com
V.O.C-free PacIFic 2009MLF soldering
thesis’ scanning to achieve production line
flux from INTERFLUX® Electronics N.V.
speeds. Use of CT technology eliminates
New tool for SMD carrier splicing
has proven to dramatically reduce solder
the clutter from bottom side parts while
deki TOOLS introduces a new SMT splice
ball occurences. When compared to other
top side parts are inspected. Because CT
hand tool. The tool simplifies the usage of
VOC-free fluxes, and even some alcohol
scanning technology alone can be quite
clips that are used for splicing. Instead of
46 – Global SMT & Packaging – March 2009
www.globalsmt.net
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