New Products
Heraeus introduces new tin-lead
solder paste formulation
Heraeus’ brand new tin-lead solder
paste, F377, is the result of a two-year
development cycle that employed early
customer involvement and Design for Six
JTAG ProVision and JTAG Visualizer. Sigma tools to create a breakthrough new
ProVision combines advanced automation product. Formulated from scratch as a
with the level of control and precision completely new platform, F377 surpasses
that engineers demand when creating test industry performance benchmarks by using
programs and in-system programming (ISP) modern raw materials which have been
routines for PLDs and flash memories. statistically proven in real-world testing
JTAG Visualizer on the other hand allows to produce the most desirable and stable
users to view JTAG-oriented files (such results. This new product represents a sub-
as fault reports) superimposed onto the stantial improvement over other tin-lead
schematic or layout of the PCB under test, solder paste options, most of which were
and hence provides an invaluable aid to
SIPLACE shutterless S-feeder
formulated in the last decade and use older
diagnosing manufacturing process faults.
improves component supply
materials technologies that induce lot-to-lot
The latest versions of JTAG ProVision and
S-series tape feeders have been one of the
performance variations.
JTAG Visualizer are available free of charge
most important components of many Si-
www.heraeus-contactmaterials.com
to customers with valid maintenance con-
place placement machines for many years.
tracts.
www.jtag.com
With its new 3x8 mm shutterless S-feeder,
Bliss launches revolutionary
FLEXconveyor line
Siemens Electronics Assembly Systems
Bliss Industries Inc. launched the FLEX-
(SEAS) now presents another improved
conveyor, ‘a box-build factory on wheels.’
version in the series. Fewer movable parts
The FLEXconveyor and complete manual
mean longer life and more reliability. The
conveyorized box-build line revolutionizes
new feeder also handles a broader spec-
box build and maximizes lean manufactur-
trum of components and makes the user’s
ing, providing a new way to kit products
job easier. As a special benefit, owners
in advance—simply unclamp and re-clamp
of classic 3x8 mm feeders can have them
any section of the line at any time. The
upgraded to the shutterless version.
box build line is the ideal solution for low-
www.siplace.com
and high-mix facilities. And setting up a
New vacuum vapor phase reflow
box build line has never been so easy and
technology
simple: Bliss does all the work—customers
simply start up their assembly line after the
Manncorp hot bar soldering
Offering a wide range of advantages over
system arrives.
www.blissindustries.com
systems bond unlikely materials
traditional vapor phase soldering systems,
Innovative new hot bar soldering systems
the VPS Condenso vacuum system from
Enthone introduces OrmeSTAR™
from Manncorp solve the challenges of
Rehm Thermal Systems delivers extremely
Ultra Nanofinish® organic metal-
bonding unlikely materials—flex circuits,
effective thermal transfer due to the even
based PWB final finish
ribbon cables, wires, edge connectors and
release of heat during condensation and
Enthone Inc., a business of Cookson
more—to PCBs. The semi-automatic ma-
the perfectly constant temperature of the
Electronics, has introduced OrmeSTAR
chines, also referred to as pulse bonders,
medium. The specific boiling point limits
Ultra PWB final finish. The organic metal-
employ thermode technology to generate
Condenso’s maximum soldering tempera-
based, nanofinish® technology consumes
rapid reflow by pulse heating. This proce-
ture, preventing damage by overheating.
approximately 90% less energy and creates
dure allows materials with low temperature
Subjecting the molten solder to a vacuum,
less waste versus electroless nickel/immer-
resistance to be soldered at lead-free-com-
Condenso enables remaining residues and
sion gold (ENIG) and other traditional
patible high temperatures without damage
gas inclusions to easily escape to guarantee
metallic final finishes. When compared to
to the devices being permanently attached
void-free soldering with lead-free solders.
ENIG, OrmeSTAR Ultra reduces process
to circuit boards. Two systems are offered,
www.rehm-group.com
time by 75%. The finish costs 30% less
which differ only in their feeding mecha-
nisms.
www.manncorp.com
then ENIG, with no “black pad” risk. The
44 – Global SMT & Packaging – March 2009
www.globalsmt.net
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