Contents
Volume 9, No. 4
April 2009
American edition
Global SMT & Packaging
is distributed by controlled
circulation to qualified
Contents!
personnel. For all others, sub-
scriptions are available at
2 The end is near 10
a cost of £165.00 for the
Trevor Galbraith
current volume (twelve issues).
TechNology Focus
No part of this publication may
be reproduced, stored in a
10 Hot air solder leveling in the lead-fr
!"*
ee er
+,-
a
.) !"#$%&'()
retrieval system, transmitted
Keith Sweatman, Nihon Superior Co., Ltd
in any form or by any means
electronic, mechanical, 20 Vapor phase vs. convection reflow in RoHS-compliant
photocopying, recording or assembly
otherwise without prior writ- Dan Coada, EPIC Technologies
ten consent of the publisher.
20
No responsibility is accepted for
30 Conquering SMT stencil printing challenges with
the accuracy of information
today’s miniature components
contained in the text,
Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative
illustrations or advertisements.
Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.
The opinions expressed in the
articles are not necessarily those
speciAl FeATures
of the editors or publisher.
38 Interview: Krassy Petkov—Milara, Inc.
40 APEX preview 38
ISSN No. 1474-0893
© Trafalgar Publications Ltd
Designed and Published by
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regular columns other regular Features
4 IC packaging technology retrospective— 5 Global SMT online
part 2 6 Industry News
Joe Fjelstad 42 New Products
50 Association News
24 Bottom reached, ‘turning point’ in sight? 52 International Diary
Walt Custer and Jon Custer-Topai
Can a HASL finish provide PCBs
with the most robust guarantee of
solderability? See page 10.
[Image courtesy Cemco-FSL.]
www.globalsmt.net Global SMT & Packaging – March 2009 – 1
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