APEX preview: The Vendor Forum
The Vendor Forums
Daily at booths 1383 & 2633
Global SMT & Packaging and Circuits Assembly are co-hosting a Vendor Forum at their combined booths. Visitors on the show floor can
drop by throughout the day to hear a range of presentations on a number of process-related issues. Panel discussions will also be held, with
topics ranging from cleaning, printing and pick and place to solder and test. The panel discussions will be videotaped and made available
on the Global SMT & Packaging APEX Show Central website (http://apex.globalsmt.net).
Tuesday, March 31st
Magna-Print—
Innovative PCB
The advantages
cleaning fluids
Reballing and Process reliability
of a universal
for cleaning
prebumping BGAs, in selective solder- Embedded device
squeegee system TBA
leading-edge
CSPs and QFNs ing technology
12:00-12:30 1:00-1:30
technologies
2:00-2:30 2:30-3:00 3:00-3:30
1:30-2:00
Charlie Moncavage Mike Scimeca Mike Bixenman Jan Martin Christian Ott Mark McMeen
Ovation Products FCT Assembly Kyzen Corporation Martin GmbH SEHO USA STI Electronics
Wednesday, April 1st Thursday, April 2
Stencil cleaning for Thermal quality
improved print management Selective Soldering Head in Pillow—
yields program TBA cleaning topic on PCBs BGA defects
12:00-12:30 1:00-1:30 2:00-2:30 3:30-4:00 12:12-30
Bill Schreiber Grant Peterson Mike Konrad Eddie Groves Mike Burgess
Smart Sonic Corp ECD Aqueous Tech. Pillarhouse Int’l AIM Solder
Panel Discussions
Five panel discussions take place over the course of the vendor forum, moderated
by Trevor Galbraith and Mike Buetow.
Cleaning—Tuesday, March 31st, 11:00-12:00
Printing—Wednesday, April 1st, 11:00-12:00
Pick and place—Wednesday, April 1st, 2:30-3:30
Soldering & profiling—Wednesday, April 1st, 4:00-5:00
Test and inspection—Thursday, April 2nd, 11:00-12:00
Trevor Galbraith Mike Buetow
www.globalsmt.net Global SMT & Packaging – March 2009 – 41
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