events
Bosch and X-Fab Executives to Keynote the MEMS Executive Congress Europe in Munich
11 March 2014 Munich, Germany
Rudi de Winter, CEO of X-Fab Silicon Foundries AG, and Klaus Meder, president of automotive electronics at Robert Bosch, will provide keynote speeches at the MEMS Executive Congress Europe to be held in Munich, March 11, 2014.
The one-day event, now in its fourth year, is organised by the MEMS Industry Group, an association of MEMS-related companies, and has grown in significance partly due to Europe's leading role in the proliferation of MEMS devices in consumer applications.
The theme for the event in 2014 is ‘MEMS- enabled life’ and a mix of keynotes, presentations and panel discussions is intended to explore the future of MEMS in the connected home, the connected automobile and the smart city, as well as the growing role of MEMS in health and well-being applications.
"From the smartwatch on your wrist to the thermostat on your wall, MEMS is dramatically improving the consumer experience at decreasing price points," said Karen Lightman, executive director of the MEMS Industry Group, in statement. "With European companies and research organisations at the forefront of new developments in these markets, MEMS Executive Congress Europe allows the global MEMS community to tap into European innovation." Panel discussions will be held on MEMS in automotive, moderated by Marc Osajda, director of pressure sensor business at Freescale Semiconductor Inc., and on MEMS in consumer products, moderated by Roland Helm, director microphones and reliability at Infineon Technologies AG.
MEMS Executive Congress Europe
www.memscongress.com
11 26 MAR MAR
Conference Programme of Smart Systems Integration 2014 Has Been Released
26–27 March 2014 Vienna, Austria
60 lectures, 46 poster presentations and five keynotes await delegates attending Smart Systems Integration 2014 from 26–27 March 2014 in Vienna, Austria. Top class speakers from science and industry provide international experts with the most recent developments, applications and trends to the following topics:
• 3D integration and interconnect technologies • Design of smart systems • Manufacturing of smart systems • System integration and packaging
Highlights of the conference are the keynotes by the European Commission, the Federal Ministry of Transport, Innovation and Technology Austria, STMicroelectronics, Bosch Sensortec and AVL/IST. Two sessions by EPoSS, a special session on smart systems co-design as well as a special session on perspectives of smart systems round up the programme.
The 2014 fringe programme — opportunities for networking and innovations The pre-conference field trip on 25 March 2014 is heading to Aspern, called Smart City. Participants have the chance to visit the construction site in the first development stage including construction logistic centre, technology centre and visitor centre with exhibition. The traditional conference dinner on 26 March 2014 is taking place at the Palais Ferstel. The exclusive dinner offers plenty of time for intensive discussions and networking.
The exhibition showcases the sector Research institutes, component and system manufacturers, suppliers as well as service providers in the micro and nano technology, sensors, wireless communications, micro electronic and micro mechanics sectors showcase their products and solutions at the accompanying exhibition. Exhibitors meet a highly specialised international target group of experts, users and scientists.
www.SmartSystemsIntegration.com
50 | commercial micro manufacturing international Vol 7 No.1
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