iNTERCONNECT
Achieve superior power delivery and distribution with Molex’s vast array of power connectors
The need for high-current power interconnect solutions in increasingly smaller spaces continues to rise rapidly. As demand grows for more power in smaller packages, solving the power equation on new architectures and system platforms can pose electrical and mechanical design challenges. Molex is uniquely equipped to provide
power delivery and power distribution in wire-to-wire, wire-to-board and board-to- board configurations. Molex’s wide selection of power connectors including the popular and proven Mini-Fit®, Micro Fit 3.0™ and KK® families will offer designers the ability to realize all their power interconnect needs from one source. Features including blind mate, TPA (terminal position assurance), reflow process compatible headers and positive locking are available. These off-the-shelf connectors can be modified, customized or adapted to meet virtually any application requirement.
EXTreme Power™ Connectors
EXTreme Power™ products offer high- current interconnect solutions with best in class power densities. The extensive product offering ranges from EXTreme Micro-Power 16.0A blades to EXTreme Power-Mass 150.0A modules. The Molex EXTreme Power™ family of products is the direct result of listening intently to our customer’s electrical and mechanical design challenges. Since no two applications are the same, the Molex EXTreme Power™® offering is comprised of several product families that cover a wide range of current levels, mechanical envelopes, mating terminations, and configuration choices; giving system designers the ability to maximize their power interconnect needs.
For more information visit
avnet-abacus.eu/molex Power and High-Power Connectors
www.avnet-abacus.eu
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focus magazine - issue 17
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