Front End I News
Lattice Semiconductor’s new iCE40 FPGAs slash power consumption 100 fold
Last month saw Lattice Semiconductor unveil its new ultra-low-density iCE40 FPGAs, delivering what it described as the ‘world’s most flexible, single-chip sensor solution’. Intended for a new generation of context-aware, ultra-low power mobile devices, the new additions to the iCE40 FPGA family will allow customers to integrate more functions into a smaller space reducing both board space and system complexity. With hard IP for strobe generators, I2C and SPI interfaces, theses new iCE40LM FPGAs are able to deliver near-zero latency to the mobile market, enabling context-aware systems with the real-time capturing of user and environmental inputs with minimal delay or error. As a result designers have a platform for their mobile products to deliver media-rich
experiences based on movement, travel direction, location and other interactions with the environment.
The small size of the device enables integration of advanced functions such as IrDA, barcode emulation, service LED, and more in a single chip with available logic for addition customer defined functions. Moreover, Lattice has
demonstrated the iCE40LM FPGA solution can reduce power consumption
Autosplice extends direct board interconnect technology (DBiT) capabilities
Autosplice has expanded its Direct Board Interconnect Technology (DBiT) capabilities to encompass a widening range of application requirements. DBiT is an innovative process of terminating lead wires or flexible circuits directly on to a PCB. The process eliminates the need for costly connectors, while producing a high quality
connection. DBiT connection types include: Wire to PCB; Component to PCB; Flex Circuit to PCB and Wire or
component to flex circuit. Direct connection
of Wire, Component Lead, or Flex Circuit can be quickly and easily achieved with the use of a crimping system and requires
no subsequent soldering steps to complete the connection. These DBiT techniques have the advantage of solderless operations that result in more reliable connections and higher sheer/pull strength than a soldered connection. Solderfree DBiT techniques also avoid any re-heating of the PCB that can damage flex circuits or temperature sensitive components.
Because automated DBiT equipment makes use of continuous-feeding of the splicing material, every interconnection can be placed precisely on the PCB without either wasted motion or incurring any material waste or scrap. Not only do
6 November 2013
DBiT looks to address the continuing challenges associated with interconnecting to and from printed circuit boards. Circuit densities are constantly increasing, thus requiring better ways of getting signals off of a board or moving signals directly from one board to another. Plus, the combination of higher performance product designs and the need for reduced power consumption is demanding more reliable board-to-lead connections for cleaner power and ground. DBiT provides high- reliability interconnects while at the same time improving production yields and reducing manufacturing costs.
Components in Electronics
they eliminate soldering hassles and risks to both personnel and materials, DBiT connections result in production outputs that are significantly higher than hand- soldering, resistance and ultrasonic welding processes.
by100x over traditional application processor-only implementations, so
increasing battery life to bring more value to the end user.
Commenting Joy Wrigley, senior
product line manager for Lattice’s Ultra- Low Density Families said, “We’re investing in packaging technologies that integrate more function and shrink system size, allowing OEMs to affordably integrate a greater variety and number of sensors into their mobile systems. Context awareness is truly a game changer in the mobile industry and iCE40LM sensor solutions enable designers to access this differentiation immediately.” Seen as critical for ‘the internet of things’ and ‘always-on’ applications, the new additions to the iCE40 family are tiny, measuring just 1.4mm x 1.48mm x 0.45 on an advanced 0.35mm ball pitch packaging.
NANOTHERM wins Innovation Award for Chip-on-Heat-Sink technology
Cambridge Nanotherm, a manufacturer of advanced substrates for high- temperature electronics, has won a Frost & Sullivan Innovation Award for its Chip- on-Heat-Sink designs enabled by NANOTHERM, a substrate technology that combines ultra-low thermal resistance with high dielectric strength. Manufacturers of electronic devices that run hot, such as power supplies, power LEDs and thermoelectric circuits, can achieve much improved thermal performance and electrical isolation by using NANOTHERM, at a substantially lower cost than comparable aluminium nitride-based substrates in use today. By reducing the cost of producing a strong dielectric (75kV/mm) with ultra-low thermal resistance (0.02°Ccm2/W), Cambridge Nanotherm believes that it has brought high thermal performance within reach of a much wider range of applications.
NANOTHERM draws on a patented technique for growing a dielectric ceramic layer of nano-scale aluminium oxide crystals on aluminium of any shape. It enables precise control of the ceramic layer’s thickness to sub-micron tolerances, to produce substrates with precisely specified dielectric strength and thermal resistance.
In the Chip-on-Heat-Sink (CoHS) implementation cited by Frost & Sullivan, a NANOTHERM dielectric layer grown on a heat sink is combined with metallisation, which bonds a copper circuit layer to the dielectric. This allows a
chip to be mounted directly on a heat sink, eliminating the PCB and adhesive layers which are required in conventional assemblies, and which constrict the flow of heat from the chip to the heat sink. Frost & Sullivan recognised the value of this technology to manufacturers of LED lighting equipment, awarding Cambridge Nanotherm its 2013 European Thermal Management Solutions for LED Lighting Technology Innovation Award.
Describing NANOTHERM CoHS technology, Frost & Sullivan said “The temperature at which the LED die runs is lowered by up to 22°C. As such, higher power can be pushed to the LED, thus increasing its light output. This in turn means customers can operate fewer LEDs but get higher light output at the same time.”
Steven Curtis, Chief Engineering
Officer at Cambridge Nanotherm, said: “This Frost & Sullivan innovation award is a testament to the huge impact NANOTHERM is set to make across of a wide range of high-temperature electronics applications. Until now, the very high thermal performance of advanced dielectric materials has only been matched by their very high price.“ Products based on NANOTHERM technology are available now in production volumes and include isolated heat sinks, CoHS implementations, substrates for hybrid circuits, and lightweight replacements for direct- bonded copper substrate.
www.cieonline.co.uk
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