Front End I News
CEVA introduces TeakLite-4, a 32-bit DSP architecture for audio and voice applications
CEVA, a licensor of silicon intellectual property (SIP) platform solutions and DSP cores, has introduced the CEVA-TeakLite-4, a new powerful, low power and scalable 32-bit DSP architecture framework designed for advanced audio and voice applications. The CEVA-TeakLite-4 looks to address the increasingly complex requirements of voice pre-processing and audio post-processing algorithms as well as multi-channel audio codecs, for smartphones, mobile computing and digital home devices.
Built on the foundation of the widely- used CEVA-TeakLite family, the CEVA- TeakLite-4 introduces new smart power management technology and supports customer-owned extensions, making it a flexible architecture and suitable for most area and power sensitive designs. Illustrating this, the CEVA-TeakLite-4 consumes up to 25% less die area and requires up to 30% less power than the previous generation CEVA-TeakLite-III DSP for decoding MP3 with Dolby Mobile 3+ post-processing. To deliver better voice intelligibility in noisy environments for example, advanced pre-processing technologies reduce the background noise and improve voice clarity, requiring support for computational- intensive algorithms. In mobile and home entertainment devices, audio post- processing creates a vastly-improved consumer experience, but the processing required needs a level of performance significantly more complex than what can be efficiently achieved with 16-bit and 24-
bit DSPs used today, bringing 32-bit audio processing to the forefront.
Commenting Eran Briman, vice president of marketing at CEVA said, ”The CEVA-TeakLite-4 architecture can address the specific requirements of any advanced audio and voice enabled SoC through a choice of scalable and flexible DSPs, which share a common instruction set architecture, software ecosystem and tool set. Furthermore, the integration of our second generation smart power management technology, PSU 2.0, enables the CEVA-TeakLite-4 architecture to deliver the lowest power consumption package possible, for each specific application.” The CEVA-TeakLite-4 architecture is initially available as a series of four compatible DSP cores, offering designers a range of application-specific cost/performance alternatives to meet their application requirements. The CEVA-TL410 and CEVA-TL411 DSPs offer single and dual 32x32 bit multipliers, respectively, targeting voice and audio CODECS and hubs, while the CEVA-TL420 and CEVA-TL421 DSPs offer additional fully cached memory subsystems and AXI system interfaces, targeting Application Processors and home audio SoCs.
Courtesy of a variable 10 stage pipeline,
Investment: Huber + Suhner has announced the completion of a major investment at its Bicester manufacturing facility. The investment includes a remodelling of its class-leading RF cable assembly facility. According to the company’s UK general manager, John Biggs, the investment in production capability was needed to cope with a growing demand from all of its strategic markets. “We needed to remodel our production areas to ensure we continue to respond to customer demands as well as industry trends,” said Biggs. “Customers are increasingly requesting their finished products produced and tested to more exacting standards on even shorter timescales and our new RF facility will enable us to meet those expectations.”
the CEVA-TeakLite-4 architecture scales from an area-optimised implementation of less than 100K gates and ultra-low power consumption, up to a 1.5GHz implementation at 28nm for high-end SoCs. All CEVA-TeakLite-4 DSPs leverage CEVA’s second generation Power Scaling Unit (PSU 2.0) which dynamically supports clock and voltage scaling with finer granularity within the processor, memories, buses and system resources. Following on from industry-proven
CEVA-TeakLite-III DSP, The CEVA-TeakLite-4 is the second generation 32-bit DSP architecture from CEVA, and the fourth generation DSP overall that shares the foundations of the CEVA-TeakLite DSP architecture.
The first members of the CEVA-TeakLite- 4 DSP family will be generally available for licensing in Q2 and Q3 of this year.
Springsoft releases third generation Laker custom IC design platform and new analogue prototyping tool
The IC design software company, SpringSoft, has unveiled the Laker3 custom IC design platform and a new Laker Analog Prototyping tool. This is the third generation of the popular Laker product family and delivers a complete OpenAccess (OA) environment for analogue, mixed-signal, and custom digital design and layout for 28 and 20- nanometer (nm) flows. The new platform provides an entirely new interactive and modernised software infrastructure for all OA-based Laker products, including the Laker Advanced Design Platform (ADP), Laker Custom Layout System, Laker Custom Digital Place and Route, as well as the new Laker Analog Prototyping tool. The platform increases OA performance, introduces next-generation layout technologies that are tuned for 28nm and 20nm design rules, and fully supports multi-vendor design flows with Interoperable process design kits (iPDK) and third-party tool integrations.
The new Analog Prototyping tool has been developed to provide early feedback on the impact of layout parasitics and other layout dependent effects (LDE),
4 April 2012
which can be particularly challenging to manage at the 20nm node. Its unique capabilities enable automated constraint generation, layout exploration, and rapid implementation in a single flow. The Laker3 platform is built on a performance-driven infrastructure with pervasive multi-threading, new ultra-fast drawing capabilities, and 2-10X faster read/write operations compared the Si2 OpenAccess reference implementation. It also features an updated graphical user interface (GUI). The design entry, custom layout, custom digital place and route, and analogue prototyping tools share the same binary executable creating a unified environment that enables passing of design intent between tools improving overall accuracy and user productivity.
A new DRC engine that addresses 20nm design rules is used by Laker automation tools and for rule-driven editing during layout. For layout editing with ‘sign-off’ rule decks, which is critical for 20nm designs, Laker uses the award- winning Mentor Calibre RealTime interactive DRC tool. In addition, beginning with this release, interoperable PyCells can
Components in Electronics
now be used with all Laker automation features that previously supported only MCell parameterized devices . The Laker Analog Prototyping tool is
built directly into the Laker SDL flow to automate the process of analysing advanced process effects and generating constraints to guide circuit layout. This rapid prototyping flow results in a more predictable design cycle and improves productivity with less time wasted on post- layout design adjustments compared to conventional methods.
“Laker is the most widely used and
broadly supported custom design solution with unmatched support for interoperable PDKs and multi-vendor tool flows,” said Dave Reed, senior director of marketing for custom IC design solutions at SpringSoft. “The new Laker3 platform builds on this foundation through the experience gained working with many customers worldwide and our continued investment in next-generation technologies. Collaboration with leading- edge companies working at 20nm was especially instrumental in driving the important new capabilities needed for advanced geometries.”
New facilities: ITT Interconnect Solutions has announced a major investment at its Basingstoke, UK facility which will enable the global connector manufacturer and supplier to deliver assembled MIL-DTL-38999 connectors with more competitive lead times. The company sees this move as part of a wider initiative to support the military and aerospace market, and has recently redesigned its QPL-approved MIL-DTL-38999 product line-up to simplify manufacturing and reduce costs. The £500,000 investment in Basingstoke is designed to support the local European market for a wide range of MIL-DTL-38999 products as well as other styles of connector and will give ITT the ability to full-fill volume orders for OEM customers and service value-add distributor partners who operate in the fast-turnaround small volume sector.
Design simulator: Fujitsu Semiconductor Europe (FSEU) has launched 'Easy DesignSim', a web- based design simulator for power management ICs (PMICs). The tool offers comprehensive online design simulation and support for design engineers working with Fujitsu's extensive line of power management ICs, such as converters, switches, power supplies and charge control devices.
According to Fujitsu this approach can significantly accelerate the development of consumer electronics and portable devices, as well as products for the medical electronics and office automation markets. The tool is the result of a collaborative venture between Fujitsu and Transim Technology Corporation. By simplifying circuit diagram design for power
supplies, 'Easy DesignSim' offers engineers an effective way to select the right PMIC and substantially shorten the development process.
Acquisition: Murata Electronics North America has signed an agreement to acquire RF Monolithics, in an all cash transaction. RF Monolithics specialises in wireless connectivity for a broad range of wireless applications, from individual standardised and custom components to modules for comprehensive industrial wireless sensor networks and machine-to-machine (M2M) technology. The acquisition is seen as complimenting
Murata’s growth strategy, leveraging RFM’s expertise in design and development of production ready RF modules, SAW based & RFIC short-range radios, stand-alone radio systems and platforms for M2M applications. The deal is expected to close in the third quarter of 2012.
Deliveries: The first batch of Raspberry Pi computers has been delivered. A group of schoolchildren in Leeds were the first to get hold of production models of the bare-bones computer. Costing just £16, these tiny computers have been designed to inspire people to get started with computer programming.
Since the Raspberry Pi project began, the plan
has generated huge interest from developers, hobbyists and others keen to get their hands on a cheap, easy-to-use computer. However, deliveries have been delayed twice - once because the wrong component was soldered on to circuit boards and a second time due to confusion about electromagnetic testing.
www.cieonline.co.uk
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64