Instrumentation • Electronics
Low power and control with one module
Karin Schmid looks at a new platform for the development of new two-in-one applications that integrate control and visualisation on a single hardware platform.
I
n May, AMD expanded its Embedded G-Series - which was launched at the beginning of the year - with two extremely power efficient APUs requiring a TDP (Thermal Design Power) of only 5.5 and 6.4 watts respectively.
These SFF (Small Form Factor) processors are ideally
suited to combine the multitude of small control and visualisation computer modules available on the market in a single system.
Two-in-one solutions
Since the requirements for such two-in-one solutions vary widely, COM Express COMs (Computer-on-Modules) such as the conga-BAF from congatec AG are perfect for use in this type of applications. Since the introduction of x86 multi-core technology, there
has been a strong desire to use the embedded processor cores not just for one but for several different tasks.
began to take a foothold only slowly as suitable software became available. By now the software is getting increasingly sophisticated,
and as a result of more efficient Small Form Factor processor technology, a wider and wider range of applications are possible.
Fanless low power applications
With the launch of the extremely power efficient Accelerated Processing Units (APUs) of the AMD Embedded G-Series, multi-core technology is now also suitable for cost-sensitive, fully enclosed, fanless low-power applications. Features of AMD’s Embedded G-Series APUs include
excellent graphics performance and full native interface support in a compact footprint combined with extremely low power requirements. The conga-BAF is one of the first COM Express COMs
to integrate the new, extremely power efficient AMD Embedded G-Series APUs. The conga-BAF is scalable across the full range of APUs
available through the AMD G-Series platform, starting with the new single-core G-40R at 1.0GHz and only 5.5W TDP and the dual-core G-40TE with 6.4W TDP up to the super fast G-T56N with 2 x 1.6GHz (18W TDP). This allows original equipment manufacturers to be able to finely match the computing performance with the performance requirements. Thanks to two memory sockets up to 8GB of DDR3
RAM can be integrated on the module, which helps to speed up memory-intensive applications further. In conformance with the new COM Express specification
COM.0 rev. 2.0, the conga-BAF provides 6x PCI Express x1 lanes Gen 2.0, 4x SATA 3, 1x PCI, Gigabit Ethernet, 8x USB 2.0 and EIDE interfaces.
Dedicated digital display
Fig. 1. conga-BAF is one of the first COM Express COMs to integrate the new, AMD Embedded G-Series APUs.
The goal is to combine formerly separate systems with the help of virtualisation technologies in order to streamline the equipment needed, minimise maintenance costs and improve reliability. However, up until now this was only possible for the high-
end range with relatively high processing performance and power requirements. And at first, it was all just a theory. Existing solutions
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Furthermore, developers benefit from dedicated digital display interfaces which provide VGA, 2x DisplayPort, 2x HDMI or DVI and enable the rapid and flexible integration of all types of monitors currently on the market. Thanks to all these features the conga-BAF is a perfect
platform for the development of new two-in-one applications that integrate control and visualisation on a single hardware platform. l
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Karin Schmid is with congatec AG, Deggendorf, Germany.
www.congatec.com
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