PRODUCTS Frame grabbers
Claxon-CXP4 BitFlow is now shipping its Claxon-CXP4, a quad CoaXPress-12 PCIe Gen 3 frame grabber that accelerates video transmission speed to 12.5Gb/s – or twice as fast as the current CXP 1.1 standard. Te overall architecture of the Claxon-
DesignCore carrier board New from D3 Engineering is the DesignCore carrier board, which allows engineers to connect multiple cameras or sensors to the Nvidia Jetson Xavier NX module. Sensor data is delivered via a serial link and is deserialised into Mipi CSI-2 data for consumption on the Jetson Xavier NX module. Tis allows the sensors to be placed up to 15 metres away from the processing unit. An on-board FPGA provides hardware- level synchronisation capability.
www.d3engineering.com
CXP4 is identical to the company’s previous generation Cyton CXP-6 frame grabber, allowing users to swap-out slower CXP 1.1 cameras with more powerful CXP-12 or CXP-10 cameras without major software changes or system downtime. It accommodates capture from up to four CXP-12 or CXP-10 cameras simultaneously, plus has high speed inputs and outputs to support an array of sensors and motion encoders. With four cables and four CXP-12 cameras, the maximum data transfer rate is 5GB/s, even at cable lengths up to 40 metres. By harnessing the speed of CXP 2.0, the
Claxon-CXP4 accelerates uplink to 41.6Mb/s, a benefit that enables a host to send triggers to a camera at rates of 600kHz in single trigger
Complete vision system
Polyphem WT blister pack inspection With the camera system Polyphem WT, Laetus now offers a solution for comprehensive in-line quality control on blister machines. Polyphem WT is made up of
a GAMP-compliant industrial computer with a touchscreen and a lighting unit with one or more integrated cameras. Various optional modules adapt the system to customer-specific
Image sensors
Sony industrial SWIR sensors with 5μm pixels Sony has released two SWIR image sensors for industrial imaging. Te sensors boast a pixel pitch of 5μm, smaller than traditional InGaAs pixel pitches that are currently restricted to around 10µm. Te sensor architecture also delivers high
quantum efficiency even in the visible range, which enables imaging over wavelengths from 0.4μm to 1.7μm. Te new products employ Sony’s SenSWIR
technology, in which photodiodes are formed on an InGaAs layer and are connected via copper- to-copper bonding with the silicon readout circuit layer. Te two models are: IMX990, a 1/2-type sensor
www.imveurope.com | @imveurope
(8.2mm diagonal image size) with 1.34 megapixel resolution; and IMX991, a 1/4-type (4.1mm diagonal) with 0.34 megapixel resolution. Sample shipments are planned for June and July 2020. Traditional SWIR image sensors, made using indium bumping to bond the InGaAs layer to the silicon layer, face manufacturing challenges to shrink the size of the pixels and increase pixel count. It is necessary to secure a certain bump pitch, which makes it difficult to achieve a smaller pixel size compared to current industrial CMOS sensors. Tere are other issues with conventional SWIR
sensors, including low sensitivity in the visible light spectrum. Tese factors have inhibited the penetration of SWIR imaging. Sony’s new sensors, based on the company’s
stacking technology using a copper-to-copper connection, means a 5μm pixel size can be achieved. Tis gives high image quality and a more compact sensor size. Te technology is also used to make the top
InP layer – which absorbs visible light – thinner, making it possible to transmit light to the InGaAs layer underneath. Te means the sensor has high quantum efficiency even in the visible range. Te new products also support digital output,
matching the performance of current CMOS image sensors for industrial equipment. Te sensors are ideal for a wide range of industrial applications such as material selection, contaminant inspection, and semiconductor inspection.
www.sony-semicon.co.jp/e/
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process requirements. Polyphem WT 3D uses stereoscopy to evaluate height and colour, and thus detects double or broken content within blister packs. Moreover, the module is particularly useful for inspections in low-contrast surroundings. Polyphem WT Pro Twin+ can inspect blisters successively from above and below, before and after sealing. Both modules can be combined with each other.
www.laetus.com
mode or almost 300kHz in dual trigger mode, all without requiring a dedicated high-speed uplink cable. Te frame grabber uses Micro BNC connectors, and a heartbeat packet has been added that supports time synchronisation of multiple cameras, along with the ability to host event packets so that asynchronous messages can be sent from the camera. Adding the Claxon-CXP4 to an application
is simplified by the BitFlow SDK supporting 32-bit and 64-bit operating systems, or by downloading free drivers from the company’s website for third party machine vision packages.
www.bitflow.com
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