SPIE PHOTONICS WEST
Gateway to scientific imaging
A round-up of imaging equipment on display at SPIE Photonics West in San Francisco early next year
T
he photonics community will gather once again for SPIE Photonics West in San Francisco from 1 to 6
February 2020. Photonics West will see 1,350 companies exhibiting products during the trade fair from 4 to 6 February, with 220 exhibitors present at the accompanying Bios expo on the 1 and 2 February. Imaging technology will be among the equipment on display, while the accompanying conference sessions will include scientific papers presented on various topics, but especially in the area of life sciences. Te Photonics in Healthcare session,
from 10am to 12pm on 2 February, will have presentations on: multispectral and fluorescence image-guided surgery from Richelle Hovelling at Quest Medical Imaging; image sensors for medical applications from Stefan Beyer at Berliner Glas (Keely Portway writes about technology from Quest and Berliner Glas on page 22); why low light imaging capabilities enable advances in research and medicine from Stephanie Fullerton at Hamamatsu; and hyperspectral sensing for wearables for health diagnostics from Ward van der Tempel at Spectricity. Tere will be a session on artificial intelligence in medical imaging from 1.30pm to 4pm on 2 February. Belgian institute Imec will be running a
technology forum from 12pm to 5.30pm on 3 February, which includes a talk on hyperspectral and computational imaging. Elsewhere, various entrepreneur sessions
have been scheduled, including a panel discussion on investing in photonics on 4 February from 2.45pm to 3.45pm. On 5 February, from 11.30am until 12.30pm, SPIE’s Jennifer Douris O’Bryan will run a meeting on export control for cameras, while, later that day from 3pm to 5pm, there will be a workshop on legal issues facing the
‘A Wikipedia edit-a- thon [will] update Wikipedia pages [to recognise] women scientists’
optics and tech industry, which includes international trade considerations. SPIE will host a job fair at Photonics
West on the 4 and 5 February, and also run a career summit from 2 to 4 February – the career summit includes sessions on designing a career path, communication, strategies for a successful job search, and salary negotiation. A number of workshops on equity,
diversity and inclusion have been organised. One of these events, on 2 February from 5pm to 7pm, will be a Wikipedia edit-a- thon, where visitors are invited to update Wikipedia pages about women, ethnic, or racial minority scientists that don’t get the recognition they deserve.
30 IMAGING AND MACHINE VISION EUROPE DECEMBER 2019/JANUARY 2020 Exhibitors
Among the exhibitors at Photonics West, Basler (booth 152) will be showing its Ace2 camera series, which includes the Ace2 Basic and Ace2 Pro lines. Both feature CMOS sensors with excellent image quality, optimised hardware design, and are available with GigE and USB 3.0 interfaces. The Ace2 Basic line is designed
for routine tasks, while the Ace2 Pro provides support for more demanding requirements thanks to powerful in-camera features such as Pixel Beyond and Compression Beyond. Basler will also exhibit its
Blaze industrial 3D camera that operates on the pulsed time-of-flight principle. Its laser diodes (VCSEL) work in the NIR range (940nm), generating 2D and 3D data in one shot with a multipart image, incorporating range, intensity and confidence maps. The Blaze camera offers VGA resolution via Sony’s DepthSense sensor technology. It is robust to outdoor lighting and offers powerful features at an attractive price.
www.baslerweb.com
Evaluation kits for two of Canon’s latest CMOS image sensors – the 120MXS, a 120-megapixel CMOS sensor; and the 3U5MGXSBA, a 5-megapixel global shutter sensor – will be on display on the Critical Link booth (235). Developers can use the kits to test sensor features and performance. System designers gain access to assets that accelerate development time, including complete sensor board design files. For applications that require on-board image processing, the evaluation kits feature an open architecture design, with the option to embed processing and software with the on-board CPU and FPGA fabric. The kits consist of a camera with a pre-installed Canon CMOS sensor, and include: an accessory package for out- of-the-box operation (quick start guide, power supply, compact tripod, cables); embedded software to set up the sensor, acquire image data and communicate over USB 3.1 interface; a PC-based user interface application to
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