PRODUCT UPDATE
New, space-saving optical splicing and distribution enclosure available from AFL
AFL has launched the LightLink 550 optical splicing and distribution enclosure (LL- 550), a compact wall-mounted enclosure that builds upon the success of its larger counterpart, the LightLink 580, by providing similar patching and splicing capability, but in a smaller form factor.
EXFO launches ‘fastest’ passive component test system for IL and RL measurement
EXFO has launched what it refers to as the ‘fastest test system’ for insertion loss (IL) and return loss (RL) measurement for a wide variety of passive components.
Integrating cutting-edge technology from
the recently acquired Yenista Optics, EXFO’s new CTP10 can be used by research scientists
New Calient optical circuit switch developed in response to demand for growing device counts
The LL-550 is useful for business service
hand-offs, MDU distribution and connectivity, cellular backhaul and other commercial services that require weather-proof field connectivity, but may have size constraints due to crowded cabinets, telco closets or other congested mounting surfaces. Available with up to 48 SC UPC or APC connections, as well as a splice-only configuration for up to 144 single fusion splices or 576 ribbon fibres with mass fusion, the new enclosure can also be coupled with accessories, such as the slack storage conduit skirt or telescoping skirt. It protects sensitive optical components from weather and natural elements, as well as vandalism and malicious intrusion. In addition, its heavy gauge aluminium construction and flexible locking features ensure that only authorised personnel have access to the internal components.
www.AFLglobal.com
Adolite unveils new technology to help stay ahead of data growth
New starter, Adolite’s latest technology is designed to help providers keep up with accelerating data growth. The company’s patent-pending
Calient Technologies’ Edge|640 is an optical circuit switch with 640 fibre-optic cross connections – up to twice the capacity of the company’s existing S320 OCS. The switch was developed for data centre, telecommunication and test laboratory applications in response to growing device counts and the need – due to network virtualisation – for increased connectivity. Key applications include wireless network radio-to-baseband units; test lab automation shared test resources and data centre GPU, FPGA and storage compute clusters.
It is organised into two switching groups of 320 ports each. Devices connected to a switch port on one of the switch groups can be connected to a device on any of the ports in the other switch group. This connectivity is suited to ‘wire-once’ network applications or testing applications where devices under test need access to a range of test systems. Leveraging the company’s 3d micro-electrical
machine optical mirror technology, the Edge|640 is transparent to data speed and is protocol agnostic, enabling the switch to support optical connections up to 400Gb/s. The all-optical nature of the switch results in very low latency connections and it features built-in optical signal power monitoring on each link and low power consumption of 90W typical.
www.calient.net
@fibresystemsmag |
www.fibre-systems.com
to extensively characterise components, or in automated mode for high volume production. With a capability to measure IL and RL in a single sweep up to 1000 nm/s, it is designed to meet the needs of passive component manufacturers, who are looking for effective testing solutions to reduce testing time without sacrificing accuracy and reliability.
www.exfo.com
process replaces embedded fibre with polymer, which it says will deliver sophisticated, high-performance optical transceivers, active optical cable (AOC) and on-board optics (OBO) – at 100G, 400G and beyond. Existing transceiver designs can be complex, requiring time-
38 FIBRE SYSTEMS Issue 20 • Summer 2018
consuming and error-prone production processes owing to multiple lenses, fibre-alignment challenges and complicated assembly. Adolite embeds optical waveguides and electrical circuits into a single layer of polymer flexible printed circuit board (FPC) and
directly integrate lasers and photo diodes onto the FPC using flip-chip bonding techniques. The company says this simplified physical structure is more flexible and routable at the board level, and can help streamline the production process.
www.adoliteinc.com
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