MODELLING AND SIMULATION
Electronics everywhere
GEMMA CHURCH EXPLAINS THE BACKGROUND BEHIND EXPLOSIVE GROWTH IN THE SIMULATION AND MODELLING OF LOW- AND HIGH-FREQUENCY ELECTRONICS
The world’s electronics industry is in a period of extensive expansion. Everyday objects are getting
smarter as embedded electronics appear in a broader range of devices than ever before. Established electromagnetic areas, including antenna design and placement, actuators, sensors and electromagnetic compatibility, are also on the rise thanks to this widespread global electrification. As a result, the simulation and modelling of both low- and high-frequency electronics has seen explosive growth in the last few years to bring innovative products to the market in shorter timescales and to match the pace of consumer demand. This rapid growth shows no signs of
stopping and applies to both recognised electromagnetic (EM) markets including automotive, marine, aerospace, communications, power engineering, consumer goods, but also to new, upcoming applications. For example, the Internet of Things (IoT), autonomous driving, the conversion of mechanical systems to use electrical power, the introduction of smarter products with sensors and actuators in the connected world, and 3D printing applications all now need to integrate EM simulation and modelling to a greater or lesser extent. This presents many challenges from both a technical and human perspective. For example, Ulrich Jakobus, senior vice president – electromagnetic solutions at Altair, said: ‘One challenge is to map the reality into an EM simulation model, both in terms of geometry and material characteristics. For the geometry, Altair has great expertise in terms of CAD import / de-featuring and meshing through FE modelling tools in the HyperWorks
30 Scientific Computing World April/May 2018
platform, complementing the native capabilities of the EM products. But often the decision remains with the EM engineer what level of geometrical detail is required for a particular EM simulation.’ For instance, in an urban propagation modelling scenario, is it necessary to include all the trees and the leaves on the branches? And how do you adapt this model for different seasons when the leaves will and will not be present? It’s a thorny issue, as Jakobus added: ‘Typically, some level of abstraction or model simplification is necessary when mapping the reality into an EM simulation model based on experience.’ Then, there are the technical challenges
of covering the whole frequency spectrum. These are two-fold. Firstly, the applications are very different so, for example, the optimisation of an induction motor versus the bio-electromagnetic modelling of an MRI system represent two completely different problems. And, secondly, in order to provide efficient EM solutions, different algorithms must be provided, including full wave, high frequency asymptotic, 2D solvers, empirical models, and so on. Jakobus said: ‘Altair manages this
very well through many different solvers available in its EM tools, partially also hybridised with full mutual coupling. For example, using an integral equation-based full wave solver to model an antenna while
using a high-frequency asymptotic solver to describe the interaction of the platform where the antenna is mounted on.’ What’s more, EM simulation and modelling tools not only need to link more directly with common electronics design environments, but also introduce greater automation and simplified assembly modelling into the process. Lawrence Williams, director of technology at ANSYS, said: ‘Many electrical engineers avoided studying 3D electromagnetics because their interest was digital design, but high speeds and higher electronics density has thrust EM effects upon many more engineers. ANSYS has responded by making EM analysis link more directly with common electronics design environments.‘ When it comes to simulating EM at high
frequencies, existing tools will also need substantially more computational power. Jiyoun Munn, technical product manager of RF (radio frequency) at COMSOL, explained: ‘This could be resolved through the use of cluster computing. However, in one of our recent releases, the RF Module introduced an example simulation app, which simulates a single slot-coupled microstrip patch antenna that is fabricated on a multi- layered low temperature co-fired ceramic (LTCC) substrate.’ The results include the far-field radiation
pattern of the antenna array and its directivity. The far-field radiation pattern
Flux density in an induction machine with Skew rotor @scwmagazine |
www.scientific-computing.com
Altair
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