HIGH PERFORMANCE COMPUTING g
extremely compact, low-profile blade architectures, providing optimal performance. DCLC technology drastically
reduces the dependence on (many) fans, expensive air conditioning and air handling systems that comes with traditional air cooling. Not to mention the noise pollution from screaming fans. It also enables liquid cooling solutions that can operate with or without facility water hook-up, through its offering of liquid-to-liquid and liquid- to-air coolant distribution units. Customers employing direct liquid cooling will realise competitive benefits by lowering their cooling costs, while increasing compute density and maximising performance of their servers.’ For customers looking at the options available, it is important to understand what will work most effectively for their individual needs. Lyon continues: ‘We review customer requirements and strategically pair them with the liquid cooling technology that best serves their unique data centre application. From coldplate assemblies through to rack manifolds and coolant distributions units, users are offered a wide range of modular, scalable products that combine to deliver a reliable, complete data centre liquid-cooling solution. Customers can also partner directly with mechanical engineering and manufacturing Teams to design and build custom cooling solutions.’
In the mix For Motivair, the future brings continued advances in the design of CPUs and GPUs, which are rapidly surpassing traditional approaches to cooling, and which will drive cooling system vendors to innovate at a faster rate. Rich Whitmore, the firm’s
president and CEO, said: ‘Previously untapped markets for HPC are fuelling market demand. These systems are being installed at sites that are frequently unprepared for
“Customers can also partner directly with mechanical engineering and manufacturing teams to design and build custom cooling solutions”
today’s dense compute nodes. Because of this, the applied cooling solution must be flexible in design and scalable in nature. ‘There will absolutely be a
mixture of technologies, mainly because there are so many individually unique new uses of HPC and big data. ‘No two customers are the same and no two facilities are the same. The days of HPC systems only being used in large national labs and government sites are over. Motivair provides multiple types of cooling equipment and we listen to customer needs. From there we define if they are a candidate for standard chilled door rack cooling systems or coolant
12 Scientific Computing World April/May 2018
distribution units (CDUs). Some customers require a customised solution.’ Whitmore believes that the
migration of cooling systems back to source at rack level, is one of the largest changes in cooling technology. ‘Our ChilledDoors have
become the gold standard in active rear door heat exchanger technology, offering a rack agnostic approach, cooling up to 100kW per rack, and the global service and support services needed to accommodate the HPC market,’ he said. ‘Motivair’s coolant distribution units provide customers and computer OEM’s with an unmatched list of available options, resiliency features and heat removal capabilities. From an in-rack CDU capable of removing 100 kW to the newest floor mount CDU that removes 1.2MW in a 900mm (36”) wide cabinet, we can accommodate both current and future cooling system needs.’ For Green Revolution Cooling (GRC), customers are very much immersed in the future. CEO Peter Poulin believes that liquid cooling
addresses several problems facing the industry, and HPC applications are increasingly turning to alternative solutions to meet their ever more powerful requirements. The company’s CarnotJet liquid immersion cooling uses minimal power, while reducing the need for energy intensive chillers and air handlers. The company says that the entire cooling system benefits from using no more than three to five per cent of IT, which results in mechanical PUE (Power Usage Effectiveness) of 1.05 or less. Cost can be cut as immersion cooling is ‘almost free’ Poulin says – and negates, for example, raised floors, plenums and air flow engineering. ‘AMD has announced a new
server processor. In the fall, Intel announced their new Skylake processor,’ he says. ‘Nvidia keeps introducing new processors. All of these processors are more and more power intensive, which is creating really high densities. Customers are asking if we will be able to support densities as high as 80kW per rack by the end of the year. GRC can manage 130kW.’
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Motivair
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