NEWS MODELLING AND SIMULATION
Florida Institute of Technology receives Siemens software grant
Researchers and students at Florida Institute of Technology will be able to benefit from a partnership with Siemens that will allow it to offer students hands-on learning experiences to better equip them for future STEM careers. Siemens provided the university with an in-kind grant, valued at around $246 million in software and licensing to use Siemens’ product lifecycle management (PLM) software. ‘This is huge,’ said Florida Tech
president Dwayne McCay. ‘One of our core values is to prepare students for a lifetime of success, and this grant will offer them the opportunity to learn the cutting-edge skills that will be essential for success in advanced manufacturing.’ The software will be incorporated
into student coursework and projects related to computer-aided design, engineering simulation, industrial design, digital manufacturing and manufacturing management at Florida Tech’s Center for Advanced Manufacturing and Innovative Design (CAMID). Students in the College of Engineering and Computing and the College of Science will also use the PLM software for senior design projects, which simulate real-world applications of design and engineering principles. Siemens’ PLM software will help
students collaborate and realise their ideas by supplying accurate information as they move from design through performance engineering and manufacturing. Access to the software, combined with the mentoring offered by Northrop Grumman engineers, will provide students with invaluable learning experiences which could help enable them to tackle the most challenging projects. ‘Software is at the core of an ongoing digital transformation changing the way our customers approach the manufacturing process, from design to production into service,’ said Tony Hemmelgarn, president and CEO of Siemens PLM Software. ‘Through our partnership with Florida Tech, we are helping empower the next generation of digital talent with access to valuable hands-on training.’ ‘Having been an industry executive,
I am keenly aware that industry needs graduates who are educated using the latest, sophisticated tools and methodologies so that these new employees can be immediately productive,’ said Michael Grieves, executive director of CAMID and a university research professor. ‘This software grant will help make Florida Tech graduates highly attractive.’
MODELLING AND SIMULATION
MSC Software and Horiba Mira announce partnership
Engineers can now make use of Horiba Mira’s virtual proving ground to test durability and ride comfort using Adams Car – part of the MSC software portfolio. MSC Software, a software
provider specialising in the development of software for engineering, has announced a partnership with Horiba Mira to provide MSC users with the capabilities of Horiba Mira’s virtual proving ground. Available as a plug-in for the existing Adams software or a software package that provides capabilities for Multibody Dynamics (MBD), the virtual proving ground enables customers to test development- stage vehicles in a simulated environment. Nick Fell, the firm’s engineering
director, said: ‘Horiba Mira offers a rare combination of digital simulation and physical test capabilities that serves both sides of the product development ‘V’ cycle. To build on this, over the last two years our durability simulation team has developed the Horiba Mira virtual proving ground into a usable customer product, and we’re delighted to now make it available as an addition to Adams Car.’ The primary function of the
MODELLING AND SIMULATION Dassault Systèmes to acquire Exa Corporation
Dassault Systèmes and Exa Corporation, a provider of simulation software for product engineering, are to merge.
Under the terms of the
agreement, a subsidiary of Dassault Systèmes was to acquire all of the issued and outstanding shares of Exa common stock for a price of $24.25 per share on completion of the offer. This values the company
equity value at approximately $400 million. Exa’s fiscal year ended January 31 and its revenue was $72 million. ‘Both Dassault Systèmes
and Exa believe in the value of an integrated focus
on science and industry. It is a critical part of our commitment to delivering 3Dexperience universes that harmonize products, nature and life. Simulation of dynamic fluid flow is an important part of our multiphysics and multiscale simulation strategy,’ said Bernard Charlès, vice chairman and CEO, Dassault Systèmes. ‘With Exa’s valuable application knowledge in transportation and mobility and other industry verticals, we will accelerate our delivery of industry solution experiences to benefit our existing and future customers.’
www.scientific-computing.com | @scwmagazine With the addition of
Burlington, Massachusetts- based Exa, Dassault Systèmes’ 3Dexperience platform will provide customers with a proven, diverse portfolio of combined Lattice Boltzmann fluid simulation technologies, as well as Exa’s fully industrialised solutions. Stephen Remondi,
president and chief executive officer of Exa, said: ‘Becoming part of Dassault Systèmes’ 3Dexperience platform and Simulia portfolio will bring enormous value to our customerss.’ The transaction should be completed in Q4 this year.
virtual proving ground is the ability to generate ‘virtual’ road load data (RLD) for use in durability and ride comfort analysis of multiple vehicle systems. Such an analysis allows the study of a component to establish whether it will suffer from fatigue failure. The use of virtual RLD saves time and resources, while improving simulation accuracy at the early stages of vehicle development. It ensures that load cases are generated from road surfaces that will later be used for the validation of physical prototypes, rather than using library RLD from other platforms. The technology provides
a valuable resource for new entrants to the industry, as well as established OEMs and Tier 1 suppliers, helping them improve the accuracy of their durability simulation and reducing their reliance on prototype vehicles.
October/November 2017 Scientific Computing World
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