3D inspection delves deep into circuitry

Production capacity for 3D inspection equipment is being increased to meet demand from the electronic circuit board industry

Nara Prefecture for the manufacture of 3D automated X-ray inspection (AXI) equipment to meet the increased demand for X-ray inspection in smart factories. Saki’s expansion of AXI production enables the


company to respond more quickly to market needs, enhance collaboration with its user base and achieve synergistic effects such as improved manufacturing quality, shorter delivery times and lower costs. Existing AXI production at Saki’s IGA plant, which is also in Japan, will be transferred to the new factory at the appropriate time to consolidate all production of the X-Ray inspection equipment in a single facility. Saki’s manufacturing operations in Nara will

make use of the building and resources of DMG MORI and is almost twice the size of its current facility. The relocation enables Saki to treble the capacity of AXI system production and expand the company’s manufacturing footprint in Japan to approximately 2,600sq m (28,000sq ft).

❱❱ The AXI 3D automated X-ray inspection system delves deep into the heart of electronic circuit boards to detect potential electrical failure points; Saki Corporation, below, is increasing its manufacturing footprint in Japan to meet greater demand for its inspection systems

apanese automatic optical and X-ray inspection equipment specialist, Saki Corporation, is opening a new manufacturing plant to complement its operations in Yamato Koriyama City of the

PCB INSPECTION The AXI 3D automated X-ray inspection system has the capability of examining features of a printed circuit board, semiconductor packaging or power modules that are hidden from view, to find defects that might result in electrical failures of the products in which they’re contained. The AXI includes insulated gate bipolar transistor (IGBT) and land grid array (LGA) inspection & measurement capabilities Avoiding such failures is particularly critical for

electronics assemblies that are used in the automotive, medical device and aerospace industries. In addition, the current wave of smart factory developments is placing higher demand on complex electronics through their dependency on machine-to-machine communications. In these cases, all defects must be discovered and reported to the other machines in the production line to ensure quality and reliability. According to Norihiro Koike, Saki Corporation’s

president, the rapid progress of smart factories, industry 4.0 and connected distribution is generating a need for automated 3D inspection equipment to ensure the quality of the electronics systems that they depend on. “Systems such as the AXI have become essential

and so to meet the additional demand, Saki has invested in increased research and development to achieve even greater inspection accuracy and to optimise production,” he says. “We are continuing to develop new equipment and software to better enable machine-to-machine capabilities and the smart factory.”

AUTOMATIC QUALITY CONTROL The automated X-Ray inspection system is part of a range of PCB quality control equipment that Saki manufactures to cover the needs of electronic circuit production. The range covers solder paste inspection for screen printing and automated optical inspection (AOI) with quad directional side cameras and extra object detection capabilities. Saki has been specialising in automatic inspection

equipment using robotic vision technology for more than 25 years and is continuing to develop the next generation of robot vision systems to meet future PCB inspection requirements. T&TH

16 /// Testing & Test Houses /// April 2020

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