Cover story
as Poland, committing over 4% of their GDP. The current US administration has recently announced a $1 trillion defence budget for fi scal year 2026, refl ecting a nearly 12% increase from existing fi scal year spending levels. Governments and defence agencies are concentrating on modernisation and readiness, accelerating investments in advanced technologies and placing unprecedented importance on strong and resilient supply chains, which were, in many cases, overhauled following material shortages during 2019-2022. Notably, increased global defence spending will not only
focus on next-generation technology. There is an immediate need to procure and protect existing technology platforms to meet today’s needs, prompting military and aerospace programs to extend their service lifecycles well beyond original expectations. This extended operational period exacerbates obsolescence challenges. OEMs and their sub-tier supply chains must manage increasingly outdated components that were originally meant for shorter-term use. Their “Last Time Buy” (LTB) stock holding will no longer meet operational requirements and continues to grow with seemingly no limits. Supply chain management in the defence sector is
more critical than ever. Programs often involve extended development times, prolonged lifecycles, and strict reliability and compliance standards. As electronic systems age, managing obsolescence becomes paramount, driving the need for proactive procurement strategies, long-term budgeting, and careful planning for transitioning to next- generation systems or sustaining current ones. The industry is navigating a crucial juncture; organisations may be forced to weigh the advantages of leveraging Commercial-Off-The- Shelf (COTS) solutions and outsourcing against maintaining organic, domestically-controlled capabilities. This balance is vital as strategic autonomy becomes increasingly essential due to global instability, trade disruptions, and supply chain vulnerabilities.
Eff ective practices for managing semiconductor supply chains to mitigate risk include: • Strategic Alignment: There are minimal semiconductor shortages in the semiconductor market cycle. Align with key supply chain partners you can trust and who can provide value, and choose products on new systems primarily supplied by Original Component Manufacturers (OCMs) with a proven record of long-term product lifecycles.
• Dual Sourcing: To mitigate risk, approve product from multiple OCMs when possible.
• Advanced Warning Systems: Establish proactive communication channels with trusted suppliers to anticipate market challenges such as extended lead times and component shortages. Understand the four major reasons why a semiconductor component becomes obsolete rather than waiting for an LTB notice to react: silicon obsolescence
or fab process obsolescence, package obsolescence, tester platform obsolescence, and/or unmet revenue targets.
• Comprehensive Lifecycle Tracking: Automated lifecycle- tracking algorithms provide insights from authorised end- of-life suppliers. Components marked as “discontinued” or “obsolete” by the OCM can often remain active for decades as licensed and traceable solutions through 100% authorised aftermarket sources.
• Proactive Collaboration: Leverage supply chain strengths, engage early and strategically shape investments to provide your organisation with the best potential outcome. A tool alone cannot assess BOM health. Collaborating with an authorised aftermarket manufacturer will offer a more comprehensive perspective than just using a tool.
• Program Protection Plans (PPP): Actively implementing PPPs, including strategic partnerships with authorised aftermarket manufacturers, to ensure continuous and compliant distribution and production. At Rochester Electronics, we are uniquely positioned
to support these critical sourcing needs. As an AS6496- compliant distributor and licensed manufacturer, we provide commercial, industrial, automotive and military-grade semiconductor solutions that extend well beyond OCM discontinuation dates. Our inventory of fi nished products comes directly from the OCMs themselves. Rochester ensures rapid response capabilities by readily
supplying millions of military-grade components from our extensive inventory. Our in-house hermetic assembly lines offer a variety of packaging options, including Ceramic DIP, Side-Brazed DIP, Flat Pack, CQFP, PGA, Ceramic Leadless Chip Carrier, and Metal Can. This guarantees the continued availability of otherwise obsolete components. Our collaboration with OCMs provides a fully authorised and traceable sourcing solution. Additionally, Rochester’s capabilities encompass
customised workfl ows tailored to meet source-controlled drawing requirements, extensive in-house qualifi cation and testing facilities, and DLA Land and Maritime certifi cation to MIL-PRF-38535, providing Class Q and Class V microcircuits. Leveraging its test and design engineering expertise,
Rochester provides suitable component alternatives, develops specialised testing protocols, and offers tailored design solutions. These include transitioning critical obsolete components to fully compatible ASIC replacements. These ASIC solutions match the original components in form, fi t, and function. This simplifi es aerospace DO-254 re-qualifi cation processes, even for DAL-A safety-critical applications, without requiring software changes or errata. You cannot make obsolescence obsolete; it is always on
the horizon. With Rochester Electronics, you can be best prepared to face it.
For more information visit –
www.rocelec.com
www.electronicsworld.co.uk September 2025 07
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