Feature: Components


Hearing device


Component carrier


the ability to use computers, electronics and mechanics to build integrated and more intelligent systems, such as robotics and various other electromechanical systems. 3D-MID stands for “three-dimensional moulded interconnect


device” or “three-dimensional mechatronic integrated device”, combining electronic and mechanical functionalities into a single three-dimensional component. Harting’s 3D circuit technology allows 3D-MID parts or


injection-moulded thermoplastic parts to be integrated into electronic circuits and components, making them more compact and densely packed. Furthermore, injection-moulded circuit boards significantly


reduce the number of production processes and individual components, reducing assembly time and lowering production costs.


Designing with 3D-MID Te flexibility of 3D-MID technology allows device designers to create more novel systems, too; a three-dimensional component that combines electrical and mechanical functions allows for endless possibilities. Te designers lay down their requirements along with very


specific measurements. Te components are then constructed through injection moulding, which is the process of heating materials such as plastic to their melting point, and then injecting them into a mould and cooled to the desired shape. It is a process used by many industries because it can create complex shapes parts quickly for mass production. Because injection moulding is so flexible, designers can use it to


fabricate virtually anything with exact specifications. Before realising a mould, different forms of simulation can be


used to check if the parts fulfill the requirements and that sample parts can be made for rapid prototyping. Next comes laser activation through laser direct structuring (LDS), a procedure created by LPKF Laser & Electronics in 1996. A laser beam defines the conductive trace, etching the layout directly into the injection-moulded plastic component.


Antenna capsule Te injection-moulded plastic will have special additives then


laser beams can detect. Te lasers then reveal areas where the conductor structures will eventually be placed. In the chemical plating process, copper is only laid down on the


laser-structured areas, enabling the development of very precise electronic circuits. Aſter metallisation in a copper bath, conductive traces form in


the areas that have been activated, to allow metals to adhere to them.


3D-MID applications 3D-MID technology is oſten regarded as a game-changer in several applications, including sensor devices and miniaturised electronic packaging, LED carriers and lighting modules, antennas and connectivity modules. In effect, almost all industries can benefit from 3D circuits, since most need some form of miniaturisation. In the medical and healthcare markets, for example,


mechatronics is a promising discipline, used in diagnostics and treatment. Take endoscopy as an example: Tis is typically a very


uncomfortable procedure, but with 3D-MID, endoscopy modules are a lot smaller, making them far less invasive and more tolerated by patients. Instead of long endoscopic cameras and tubes, a non-invasive capsule containing a miniature camera can easily be swallowed, to then transmit 360-degree pictures from inside the body. Mechatronics are also widely used in creating new types


of prosthetics, such as the Luke Arm, a mind-controlled arm prosthesis that gives patients who’ve lost limbs the ability to perform everyday tasks. 3D-MID technologies are also used in designing smaller


hearing aids, implants and surgical and dental devices. 3D-MID-enabled possibilities go on: As the technology


advances, we'll see more of these circuits incorporated into space-saving projects, with smaller devices, reduced assembly procedures and lower costs, yet with greater functionality.


www.electronicsworld.co.uk September 2023 37


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