Products
More standard colours for METCASE’s unidesk sloping-front enclosures
UNIDESK sloping-front terminal enclosures from METCASE are now available in three standard colours: black (RAL 9005), light grey (RAL 7035) and new traffic white (RAL 9016). Custom colours are also available.
These desktop and wall-mount aluminium enclosures are ideal for a wide range of electronic and electromechanical
applications including office systems, point-of-sale, medical devices, industrial/machine control and security.
UNIDESK has a pre-assembled case body with a flat rear panel for connectors, switches and power inlets. The front panel (accessory) is recessed to accommodate a membrane keypad. The base has pre-punched PCB fixing points. Four non-slip rubber feet are supplied, along with M3 Torx T10 and Pozidriv fixings. IP 54 (VDE tested) ingress protection is optional with gaskets for the front and base panels. This protection is dependent on the addition of PCB pillars (accessory). UNIDESK is available in three standard sizes: 200 x 200 x 102 mm, 300 x 200 x 102 mm and 400 x 200 x 102 mm.
Accessories include matt anodised aluminium front panels, wall mount kits, a PCB mounting kit and PCB/panel fixing screws.
https://www.metcase.co.uk/en/Metal-Enclosures/Unidesk.htm
Tria enhances SMARC portfolio with new module based on Renesas RZ/G3E processor
Tria Technologies, an Avnet company specialising in the manufacturing of embedded compute boards, launched a new SMARC module based on a processor from Renesas. The TRIA SM2S-G3E SMARC module is one of the first solutions based on Renesas’ RZ/
G3E processor available to the market. The processor comes with up to four Arm Cortex-A55 cores running at 1.8GHz, a dedicated Arm Cortex-M33 Real-Time core and an Arm Ethos-U55 neural processor unit (NPU). It is particularly suited for applications that require a small compute platform with high performance, strong graphics, video and AI capabilities and a rich I/O feature set. The microprocessor features the Arm Mali-G52 graphics processing unit (GPU) and 4K-capable video processing unit (VPU), as well as rich security features. The RZ/G3E is capable of running AI workloads using the NPU, which is a new class of machine learning (ML) processor specifically designed to accelerate ML inference in area-constrained embedded and IoT devices. Other features include up to 8GB fast LPDDR4 with inline ECC and up to 256Gb eMMC Flash, as well as LVDS, MIPI-DSI and HDMI interface options. In addition, the TRIA SM2S-G3E SMARC module offers such high-speed interfaces as PCIe Gen.3 x2/x1, USB 3.2 Gen 2 x 1 and Dual Gigabit Ethernet. SMARC is one of the best and most future-proof standards for small form factor embedded designs and this latest announcement strengthens Tria’s SMARC portfolio with the very latest embedded modules.
https://www.tria-technologies.com/product/tria-sm2s-g3e/
New DV301x series from ifm delivers pioneering energy efficiency and sustainability
Industrial automation solutions provider, ifm, has unveiled its DV301x range of advanced
machine lighting solutions, exceeding the stringent requirements of the Ecodesign Directive 2009/125/EC. This innovative range reflects ifm’s dedication to sustainability, energy efficiency and engineering excellence, helping industry partners embrace responsible, future-focused operations. The DV301x range is designed to deliver exceptional illumination and versatile status visualisation in one compact, efficient package. Each module generates an impressive 450 lumens of light within a sleek 250mm unit, with the flexibility to link up to four modules for customised installations. Combining bright white lighting for machine area illumination with vibrant RGB LEDs for clear status signalling, this dual functionality ensures performance without compromise. Despite its powerful capabilities, the DV301x boasts one of the lowest energy consumption rates in its class, offering unparalleled efficiency at a competitive price.
Built to thrive in the toughest industrial conditions, DV301x modules feature a robust, chemical-resistant housing crafted through advanced plastic injection moulding technology.
www.ifm.com
Anritsu and AMD validate electrical PCI Express compliance to 64GT/s
Anritsu has been instrumental in AMD’s efforts to test the electrical compliance of the PCI Express (PCIe) specification in the pre-production AMD EPYC CPUs. Achieving a maximum data rate of 64GT/s using the high-performance Anritsu BERT Signal Quality Analyzer-R MP1900A, testing was done under challenging backchannel conditions with insertion
loss exceeding the specified 27 dB in the CEM specification, along with stress conditions applied using Spread Spectrum Clocking (SSC).
PCIe 6.0 technology is the next-generation standard that provides a bandwidth of 64GT/s per lane and up to 256GB/s in a x16 configuration as a high-speed interface between internal devices such as CPUs, GPUs, SSDs, and network cards. While maintaining compatibility with previous standards, it achieves highly reliable and efficient communications in fields such as AI (Artificial Intelligence), HPC (High Performance Computing), and high-speed storage, greatly contributing to improving the performance of next-generation data centres and analytical systems.
www.anritsu.com
www.electronicsworld.co.uk July/August 2025 41
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