Technology
Optical communications technology to gain from assessment of inter-core crosstalk in multi-core optical fibre
Anritsu and Fujikura have teamed up to determine whether different methods of assessing inter-core crosstalk in weakly- coupled multi-core optical fibres render the same results. Tey used a four-core weakly- coupled optical fibre made by Fujikura for the measurements (see figure right): two methods used optical power meters and two used Anritsu’s optical time domain reflectometer. All four sets of results were within ±1.0dB at 1550nm, confirming the suitability of these methods to be used in an application of weakly-coupled multi-core optical fibre – whether in R&D, manufacturing, installation or maintenance. Tis finding is very important now that
the adoption of artificial intelligence and cloud services is growing, demanding greater transmission capacity from optical submarine cables and data centre interconnects. To achieve high data throughputs in
optical communications today, advanced signal optimisation technologies are applied to single-mode fibre. However, as the transmission capacity per fibre continues to increase, such approaches are reaching
Correlation evaluation of crosstalk results in a weakly-coupled multi-core fibre from four different methods
physical and performance limits. Tus, R&D efforts have turned to weakly-coupled multiple independent cores in a single optical fibre. However, having multiple cores within a
fibre leads to crosstalk between them, due inter-core leakage, degrading the quality of the transmission. Te crosstalk depends on the optical fibre design and manufacturing, but also on its installation conditions. Terefore, its evaluation was required in field conditions. Although various companies and research institutions have proposed different methods
for measuring inter-core crosstalk, the measured results from each method have not yet been adequately validated, until now. Anritsu and Fujikura’s research confirms that using various measurement methods renders equivalent results, which will assist with future standardisation of weakly-coupled multi-core optical fibre. Anritsu now plans to introduce test
solutions for next-generation optical communications technology for weakly- coupled multi-core optical fibres.
Next-generation universal memory chips start life in the UK with a project between IQE and Quinas Technology
A scaleable production method for the world’s first quantum-powered universal memory, ULTRARAM, has just kicked off thanks to a joint project between IQE, semiconductor wafer producer, and Quinas Technology, a British semiconductor company. ULTRARAM is a dual-use technology
developed at Lancaster University, UK, which combines the non-volatility of data storing memory like flash, with the speed and endurance of a working memory like DRAM, for significantly improved energy efficiency. Applications for this universal memory include artificial intelligence, quantum computing, space and defence. Innovate UK awarded the consortium a £1.1m grant for the one-year project. This helped IQE successfully scale up the manufacture of compound semiconductor layers initially developed at Lancaster
University to an industrial process, the first step toward the commercial production of packaged ULTRARAM devices. For this, IQE had to develop an advanced capability in gallium antimonide and aluminium antimonide epitaxy, which now represents a world-first for scaleable epitaxy in memory devices. “This is a milestone towards industrial
production of packaged chips. The project represents a unique opportunity to bring the next generation of compound semiconductor materials to life in the UK and we are proud of our work with Quinas, Lancaster and Cardiff Universities to advance commercial production and create world-leading universal memory devices,” said Jutta Meier, IQE CEO. The ULTRARAM project aligns with the
UK government’s semiconductor strategy to boost domestic innovation and build
04 July /August 2025
www.electronicsworld.co.uk
leading capabilities in semiconductor technologies. The partners are now exploring further industrialisation and pilot production with foundries and strategic collaborators. “This project marks a turning point in the journey from university research to commercial memory products. With IQE’s industrial capabilities and Innovate UK’s support, we have taken a critical step toward building independent capability in memory – the most strategically vital yet under-represented segment of the UK semiconductor stack. ULTRARAM’s potential to radically improve energy efficiency in AI, mobile and data centre applications positions Britain as a leader in next- generation memory innovation,” said James Ashforth-Pook, CEO of Quinas Technology.
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