Feature: Interconnections


than legacy solutions. Moreover, there is a demand for these highly dense connectors to also be pick-and-place accessible for ease of mass manufacturing. Developing fi ne-pitch, high-speed connectors that can withstand harsh environmental conditions is an extreme challenge, especially considering how small and fragile such compact contacts are intrinsically. Fortunately, AIC is up for such a challenge and has designed a new series of board-to-board connectors that are uniquely suited to modern PCB interconnect challenges. Designed for long-life applications and robust handling, these new


Advanced


Interconnections Corp. Launches New Family Of Board To Board Connectors Featured At Electronica 2024


By Advanced Interconnections, a leading designer and manufacturer of off -the-shelf and custom interconnect solutions for the electronics industry.


Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi- pitch and custom pitch designs available. Many industrial, defence, aerospace and automotive board designers are faced with the challenge of accounting for board-to- board interconnects that are ever denser and requiring higher speeds


A 18 Dec 2024/Jan 2025 www.electronicsworld.co.uk


dvanced Interconnections Corp. (AIC) headquartered in West Warwick, Rhode Island and leading designer and manufacturer of customised interconnect solutions for the electronics industry has launched a new family of Board-to- Board Connectors. T ese new Board-to-Board


connectors are manufactured with screw-machined terminations with multi-fi nger contacts and include a wealth of value-added features and come with either protective pick-and-place covers or heavy duty, shrouded insulators. T e options of covers or insulators helps to provide positive polarisation and off er superior durability for the connectors. Available in standard pitch sizes including 0.50 mm, 0.65 mm, 0.75, 0.80 mm, and 1.00 mm, these connectors deliver low signal attenuation, insertion loss, and return loss. Even with adjacent aggressor excitation, the socket systems provide a


diff erential path of +/- 175mV @ 100 psec and a single-ended data path of +/- 125 mV @ 140 psec. Using innovative, hybrid design features, this socket technology is able to minimise adjacent terminal electromagnetic coupling, which signifi cantly reduces NeXT/FeXT. Additionally, this hybrid design creates a pseudo-matched impedance environment that stabilises the insertion loss and return loss when diff erentially driven. T ese board-to-board connectors with fi eld-proven screw machined


terminals are arranged in an interstitial male/female pin pattern that sport gold-plated contacts for high-quality gold/gold interconnect. T is added gold plating on the connector contacts minimises corrosion in most environments and provides extremely long-life contacts capable of repeated matching cycles. Unlike many other board -to-board connectors on the market,


AIC’s new connectors do not require external hold-downs and include a shrouding feature that protects the pin fi eld and aids in manual placement. T ese new connectors can be selected with either eutectic Tin/Lead or lead-free Tin/Silver/Copper solder ball terminals for RoHS compliant applications. Optional stand-off s are also available with these connectors. AIC’s new Board to Board Connections are now available in a


variety of standard options with the ability to readily customise standard off erings for application-specifi c requirements, please call +1 401.823.5200 or visit stand B2. 130 at electronica 2024. About Advanced Interconnections Corp Advanced Interconnections is the premier designer and manufacturer


of off -the-shelf and custom interconnect solutions for the electronics industry. T e reliable and innovative solutions Advanced has pioneered have fl own the skies, swam the seas, ridden the wild backcountry, and kissed the stars for a diverse range of telecommunications, military/ government, automotive, medical, aerospace and naval/maritime applications. Advanced Interconnections’ skilled team of engineers have developed


a range of fi eld-proven IC sockets, package conversion adapters, board-to-board connectors and a plethora of custom interconnect solutions. From prototype to production volumes and anywhere along the journey, Advanced is able to meet even extreme interconnect and specifi cation requirements at our fully integrated manufacturing facility in the USA.


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