Column
Hybrid Bonding Elevated to New Heights with 100 per cent Inspection
By Hari Polu, President of OKOS, a Virginia-based manufacturer of scanning acoustic microscopy (SAM) and industrial ultrasonic non-destructive (NDT) systems.
T
oday, hybrid bonding is transforming the semiconductor industry by facilitating the production
of increasingly intricate, efficient and powerful electronic devices. For the electronics industry, advanced
Scanning Acoustic Microscopy (SAM) equipment detects minute flaws as small as 5 microns in vertically stacked, hybrid bonded packages. The high-speed metrology tool allows for 100 per cent inspection, speeding manufacturing. This advancement is beneficial for
artificial intelligence, high-performance computing and graphics processing units.
The reason hybrid bonding is
quickly gaining recognition is due to the enhanced reliability and mechanical strength of its interconnects, as well as the space savings compared to traditional bump- based interconnections. This bonding technique vertically links die-to-wafer (D2W) or wafer-to-wafer (W2W) via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. Hybrid bonding offers several
significant benefits, including allowing a higher density of interconnections with shorter pitches, and less distances between the layers. These factors improve signal integrity, reduce latency, lower power consumption and increase data throughput. Furthermore, hybrid bonding facilitates heterogeneous integration, enabling semiconductor companies to merge multiple chiplets with diverse functions, technology nodes and sizes into a unified package. However, to successfully transition to high volume manufacturing with high
16 Dec 2024/Jan 2025
www.electronicsworld.co.uk
yields requires advanced metrology tools that can quickly identify defects like cracks and voids within the bonded layers. The concept behind three- dimensional advanced packaging is to stack multiple dies or wafers vertically to achieve better performance with lower
power requirements, smaller size and lower cost. However, as three-dimensional
packages become increasingly complex, so do the challenges in identifying defects within vertically stacked, multiple layers. Now, the focus is
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