Feature: Interconnects
Figure 2: ENNOVI-NET technology offers high repeatability whilst avoiding quality problems associated with solder
bandwidth for vehicle operation without compromising connector robustness requires innovative approaches. The ENNOVI-NET product exemplifies this, with its completely insert- moulded design which ensures that any mechanical stress on the connector is absorbed by the housing, not the press-fit pins themselves. This design method ensures that the press-fit pins are subjected only to the necessary insertion forces, avoiding additional strain. In setups where connectors stand
High-speed applications necessitate specific design considerations to mitigate mechanical stress on press-fit pins, ensuring their signal integrity under operational conditions, now adopted by the automotive industry
can introduce variability in the amount of solder used, potentially compromising the connection’s integrity and performance. From a manufacturing standpoint, press-fit technology offers a more consistent and reliable solution, especially critical in applications requiring high-speed data transmission.
Open debate? The debate over whether soldering or press-fit is the superior method for interconnects remains open, yet from environmental and precision standpoint, press-fit clearly takes the lead. Observing trends in the datacom
industry reveals a significant preference for press-fit technology, especially in backplane connectors, which operate at speeds of 112Gbps and beyond.
The rarity of solder-based backplane connectors in the market is a testament to the consistency and efficiency of press-fit connectors, which are designed to accommodate ever-thinner and shorter pins, for optimal high-speed electrical performance.
Robustness versus performance Whilst solder-based solutions might be perceived as more robust, the balance between reliability and performance is delicate. High-speed applications necessitate specific design considerations to mitigate mechanical stress on press-fit pins, ensuring signal integrity under operational conditions. This concept of balancing robustness with performance is now being adopted by the automotive industry, known for its stringent requirements for durability. Achieving desired data rates and
alone, the dynamics would differ, with the press-fit pins bearing the brunt of mechanical forces. However, in sensor applications like those addressed by ENNOVI-NET and conforming to standards such as USCAR and LV214, the integrated approach effectively manages these forces. Tis ensures that the connectors can withstand the operational demands placed upon them, marrying robustness with the high- speed performance essential in modern automotive applications. Trough the patented IndiCoat plating
technology that can be applied to press-fit interconnects, ENNOVI is able mitigate the growth of tin whiskers, which can pose a reliability risk or, in worst-case scenarios, induce a short circuit. Te quality of the end-product is thereby assured for a long time.
Empowering car makers Te press-fit approach empowers carmakers to leverage their existing manufacturing infrastructure whilst offering superior signal integrity and performance over traditional solder- based solutions. By facilitating 10Gb/s high-speed data transfer, ENNOVI-NET is revolutionising Automotive Ethernet connectivity, introducing a new value proposition for OEMs and Tier-1 suppliers. By adopting a press-fit variant of
the widely-used USCAR interface, the automotive sector stands to enhance its production efficiency and reduce operational costs, without sacrificing the quality or dependability of its products.
www.electronicsworld.co.uk April 2024 27
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