SENSORS & SENSING SYSTEMS  SWINDON SILICON SYSTEMS Four reasons you may need an ASIC


Ross Turnbull, director of business development and product engineering at ASIC design and supply specialist Swindon Silicon Systems, explores how ASICs could address four common product design challenges.


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very product starts with a vision that design engineers are tasked with turning into reality. However, this process is far


from straightforward, as products today must meet increasingly complex performance standards to keep up with market demand. In today’s rapidly-evolving and competitive


market, design engineers face mounting challenges in developing products that stay ahead of the curve. Modern products are expected to deliver exceptional performance while adhering  and reliability – all while meeting tight deadlines and budget constraints. As the demand for advanced, specialised designs grows, the limitations of generic, off-the- shelf components are becoming increasingly   some of the most common product design challenges.


22 February 2025 Irish Manufacturing


PERFORMANCE BOTTLENECKS  ensuring seamless performance, particularly in high-performance applications such as advanced automotive systems and Internet of Things (IoT) devices. These applications require fast, reliable data processing and general-purpose components often lack the speed and throughput to meet these demands.   be reprogrammed for a variety of tasks. However,   tasks, they can struggle to deliver at the speed necessary for high-throughput processing. This is particularly problematic for time-


sensitive applications like autonomous vehicles, where delays in processing sensor data can slow decision-making, compromising safety and system performance.


SIZE CONSTRAINTS Another issue in the product development process is size, driven by the growing demand for sleek, lightweight and high-performing devices.  functionality into increasingly limited space. More compact designs also pose thermal management challenges. As products shrink, it   at higher temperatures, which can degrade performance, reduce lifespan and even cause system failures.





integrated circuits (ICs) that meet the precise requirements of small-scale designs. Standard components, designed for general applications rather than tailored to these designs, often can’t deliver the required performance in such small systems. This forces engineers to compromise 


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