News: Rochester Electronics
The art of predicting component obsolescence
The last time buy dilemma A
s semiconductor manufacturing technology advances, older and less profitable lines are pruned. In long-term system markets, obsolescence is inevitable.
Proactively monitoring component lifecycles for components used directly by the customer, as well as those used within purchased subsystems, is crucial for anticipating problems. Luckily, commercial tools that track a component’s lifecycle, lead times, and specification changes are available. Such tools can provide alerts triggered when Product Discontinuation Notices (PDNs) are issued. However, predicting a component’s end-of-life (EOL) date is an inexact science. Algorithm- based predictions have severe limitations. Since the semiconductor allocation crisis in the early 2020s, PDNs have been increasingly imprecise and short-dated. Recently a 3rd party fabricator who gave their semiconductor client one month’s notice before closure is an example of where both wafer-fabs and packaging houses are reassessing profitability. Component discontinuations, under any circumstances, trigger an inevitable and costly Last Time Buy (LTB). Abrupt and unexpected PDNs are a challenge to even the most established LTB processes. Customers need to always consider: ● Future market needs, including in-service support.
● Redesign and replacement product timetables, and reengineering and requalification costs.
● The financial impact of purchased stock, as well as the cost of specialized storage. In some cases, this tied-up capital cost is a limit to the size of the LTB regardless of the factors above.
● Lost opportunity costs from premature product discontinuations, especially where this might provide a competitive opening in a secure market.
Underestimating needs has a risk of premature product termination. Overestimating
6 September 2024
cent authorised, traceable, and guaranteed direct from the OCMs. As a result, Rochester can offer the original component warranties and guarantees.
needs unnecessarily tie up capital in excess stock and storage costs.
How can customers best prepare for an unpredictable semiconductor discontinuation landscape? 1. Seek multiple sources of market information, that can provide in-depth risk assessments for critical components. It is vital to have a detailed understanding of the overall market, fab technology, and packaging risks surrounding key components. 2. Build relationships with authorised after-market semiconductor supply and manufacturing specialists, such as Rochester Electronics. By engaging them in discussions during the LTB process, they can assess whether to make parallel and complementary investments in finished goods. This investment provides a potential safety net if markets change, and the customer’s LTB purchase proves to be insufficient. It is not unusual for after-market suppliers to continue supplying authorised, 100 per cent compliant, risk-free components 20 years or more after the original PDN. 3. The risks of counterfeit and poor-quality components from unauthorised sources represent a significant risk to production yields and Mean Time Between Failure Rates in
Components in Electronics
the field. Inferior or substandard testing by unauthorised 3rd-parties provides false confidence that authenticity can be tested. This mimicry of testing is a visual, x-ray, or poor partial copy of the original manufacturer’s test processes. Full tri-temp testing is rarely offered, and the risk of commercial-grade components being re-marked as industrial, automotive, or military parts is always possible. Instead, find manufacturers that are 100 per cent certified by the Original Component Manufacturers (OCMs).
Over 10 billion of Rochester’s in-stock devices are classed as EOL by the original manufacturer, from which the product is directly supplied. Rochester is well- positioned to offer a continuous source of supply for applications, where the product lifecycle extends the active availability of a device. Rochester’s factory-direct offerings negate the need for expensive redesign, requalification, and recertification, and avoid the risk of sourcing hard-to-find products on the open market. Components are 100 per
Rochester Electronics is a licensed semiconductor manufacturer, offering ongoing solutions using information and technology transferred directly from the OCM. Rochester utilizes the original manufacturer’s die and fab processes, matching the original designs, assembly solutions, and test protocols. All resulting products are 100 per cent certified, licensed, guaranteed, and sold with full approval under the original manufacturer’s part number. Planning for the unexpected is also part of the risk-management process. Rochester Electronics describes itself as the world’s leading authorised after-market semiconductor supplier. Trusted by over 70 leading semiconductor manufacturers, Rochester does not only provide ongoing component availability after normal EOL, but it says it also has unique insight into industry-wide trends in wafer fabrication and IC-packaging supply chains.
With comprehensive market analysis, Rochester says that it offers customers a valuable and unparalleled perspective on component risk assessment. Our expert team provides independent forward-thinking advice, allowing businesses to mitigate risks and avoid the repercussions of prematurely terminating production or in-service support from obsolescence. Leveraging market-wide views, we empower customers to make informed decisions and ensure the seamless continuation of their operations. Plan for the unexpected. It’s vital to have partners who can support businesses during unforeseen or unplanned component discontinuations, completely risk-free whenever they occur.
For more information visit:
www.rocelec.com
www.cieonline.co.uk
https://www.rocelec.com?utm_medium=Editorial&utm_source=CIE&utm_campaign=SEPT24CIEEditorial&utm_content=Predicting_Obs_Editotial%20
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