Supplement: Electronics Industry Awards – Finalists Meet the 2024 EIA finalists…
Aerospace, Military, Defence Product of the Year
12 multimode fiber Q-ODC extension connector 7.0mm Huber + Suhner
EPC 7018 Efficient Power Conversion
Integrated Actuation Power Solution Microchip
NXS Series with EMI Flange Smiths Interconnect
Resistive Power Dividers Smiths Interconnect
SAMD21RT 32-bit MCU Microchip
Embedded Solution Product of the Year Automotive Product of the Year
GRF5507W, GRF5517W, GRF2106W and GRF2133 W Linear Power Amplifiers and Low Noise Amplifers Guerrilla RF
Molex MX-DaSH Data-Signal Hybrid Connector Portfolio Molex
NOVELDA X7 Ultra-Low Power Presence Sensor Novelda AS
OX08D10 OMNIVISION
RAA279974 Four-Channel AHL Video Decoder for Automotive Cameras Enables Economical Surround View Applications Renesas Electronics
SuperGuard: The C Library Safety Qualification Suite from Solid Sands Solid Sands
TA101IC Microchip
Engineering Development/Design Tool of the Year
Display Product of the Year ClearVue
Crystal Display Systems e-Paper displays
Review Display Systems
G185HAN01.4 18.5"” high-brightness AUO display Data Modul
microLED display Smartkem
MXT2952TD 2.0 family Microchip
P624-C 23.8"” FHD TFT Widescreen Industrial LCD Monitor Axiomtek
AI Workbench – Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation Renesas Electronics
CHERI Codasip
PolarFire® SoC Discovery Kit Microchip
Lattice Radiant™ design software Lattice Semiconductor
Palladium Z3 and Protium X3 Systems Cadence
Tracealyzer SDK Percepio AB
Apollo510 MCU Ambiq
PIC32CK 32-bit Microcontrollers Microchip
AIE-PN33/43 Aetina Corporation
NECTO Studio 6.1 MIKROE
RA8 Series – Ultra-High Performance MCUs are Industry’s First Based on Arm Cortex-M85 Processor; Provide 4X Performance Boost for DSP and ML Implementations Renesas Electronics
The ROM-2860 size-L OSM miniature solder-on module from Advantech Advantech
xcore®.ai XMOS
Internet of Things Product of the Year
Blecon Blecon
Cavli CQS290 Smart Cellular IoT Android Module Cavli Wireless
DA14592 – Renesas’ Lowest Power Consumption, Dual-core Bluetooth Low Energy SoC with Integrated Flash Enables “Crowd-Sourced Locationing” Renesas Electronics
ECC608 TrustMANAGER Microchip Technology
TCR3LM series Toshiba Electronics Europe
The AIR-150 Edge AI Inference System from Advantech Advantech
Product categories Enclosure Product of the Year
CAB P 504023 S 8104325 Fibox
HANDHELD CASE with SHOCKPROOF COVER Takachi
Monitoring Case System Phoenix Contact
BoVersa electronics enclosure BOPLA
Pi Cube CamdenBoss Ltd
Interconnection Product of the Year D04 Connectors
Smiths Interconnect
ENNOVI-MB2B multi-row board-to-board (BTB) connector platform ENNOVI
Mezza-pede® SMT Connectors Advanced Interconnections
Microflex Hi-Rel Flexible Harness – 2mm pitch – MIL-DTL- 55302F
Nicomatic
Molex MX-DaSH Data-Signal Hybrid Connector Portfolio Molex
Push-X, XPC 1.5 Series Phoenix Contact Ltd
YFLEX High Temperature Resistant Yamaichi Electronics
Medical Product of the Year CUS250M
TDK Corporation D04 Connectors
Smiths Interconnect EP71xx Family
Empower Semiconductor
MINIMET aluminium enclosures METCASE
RA2A2 microcontroller (MCU) Group Renesas Electronics
Snap-In Male cable connector, Contacts: 3, 3.5-5.0 mm, unshielded, solder, IP67 Binder
32 September 2024
Components in Electronics
www.cieonline.co.uk
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