Advertorials Lattice expands ultra-low power sensAI stack with
optimised solutions for always-on, on-device AI CNN accuracy with flexible milliwatt FPGA solutions; New reference designs for human presence and hand gesture recognition with scalable performance/power
• New CNN Compact Accelerator IP for iCE40 UltraPlus™ FPGAs with support for 16-bit and 1-bit quantization for improved performance, power, and accuracy tradeoffs
• Enhancement to CNN Accelerator IP for ECP5™ FPGAs with up to 2x increase in DRAM memory bandwidth, for improved performance in smaller devices
• New hardware platforms, reference designs, and demos showcase scalable performance and power optimised for always-on, on-device AI applications
Lattice Semiconductor Corporation (NASDAQ: LSCC) today unveiled expanded features of the company’s popular Lattice sensAI™ stack designed to speed time- to-market for developers of flexible machine learning inferencing in consumer and industrial IoT applications. Building on the ultra-low power (1 mW-1 W) focus of the sensAI stack, Lattice is releasing new IP cores, reference designs, demos and hardware development kits that provide scalable performance and power for always-on, on-device artificial intelligence (AI) applications.
www.latticesemi.com
OMC adds new dust-proof FDH1M SMA bulkhead receptacle to range of advanced fibre optic
connector systems Robust design with integrated dust seal ensures signal integrity in materials processing applications and high dust environments
OMC, the pioneer in optoelectronics design & manufacture, has announced a new receptacle for its range of fibre optic receiver and transmitter diodes. On display for the first time on Stand L30 at the Electronics Design Show, the new FDH1M SMA housing with integrated dust seal is an enhanced version of OMC’s popular FDH1 SMA bulkhead housing and is designed to protect signal integrity in fibre optic links in dust or powder contaminated environments, such as materials processing plants.
The FDH1M housing is a rugged, all-metal design with square base flange, featuring mounting holes in each corner to bolt down to the bulkhead, securing it firmly and helping to resist vibration and strain. As well as being far more robust than plastic housings, the all-metal construction of the FDH1M also helps screen the active device against radio frequency interference.
The new FDH1M SMA bulkhead receptacle is precision-machined and assembled in OMC’s purpose- built facility in the UK, and is available with a range of transmitter and receiver diodes aligned and housed within to form a dust-resistant transmitter or receiver module. The company’s engineering team has over 30 years of experience in the design of fibre optic datalinks and components, and specialises in tailoring their solutions to meet a customer’s bespoke requirements.
www.omc-uk.com
Amphenol ICC Minitek Pwr 5.7mm Connector System has high current rating, prevents mis-mating and
protects terminals – now at TTI 23A per contact, polarised mating geometry, sizes 16 – 23 AWG
Amphenol ICC’s Minitek Pwr 5.7mm Connector System for power applications requiring a high current solution is now available from TTI, Inc., a world leading specialist distributor of electronic components. Featuring polarized mating geometry to prevent mis-mating and scoop-proof housings to prevent terminals from damage, Amphenol’s Minitek Pwr 5.7mm Connector System is a flexible and comprehensive range providing a vertical through- hole and wire-to-board solution targeted at industrial & instrumentation, data, communications, consumer and military applications.
This range of board connectors has contacts rated up to 23A each, made from high-conductivity copper with either tin or gold plating. As terminals are post-
plated, they prevent corrosion from environmental contaminants including salt spray and gas. The positive locking feature on the connector housing has a low thumb latch operation that ensures secured mating retention. Operating temperature range for the Minitek Pwr 5.7mm Connector System is -40ºC to +105ºC.
Electrical performance includes: low level contact resistance of 2m max. (initial); insulation resistance of 1000M min; voltage rating of 600V AC (RMS)/DC and contact resistance for tin plated options is 10m
and gold plated options is 5m max. Mechanically, the tin-plated connectors are rated for 25 cycles and gold plated connectors to 200 mating cycles.
www.ttieurope.com
Nexperia MOSFETs deliver best-in-class Safe Operating
Area and improved RDS(on) for Hot Swap designs Ensures no compromise between protection and operating efficiency
Nexperia, the global leader in discretes, logic and MOSFET devices, today introduced the latest addition to its NextPower Live linear-mode MOSFET family, PSMN3R7-100BSE delivers a best- in-class combination of strong Safe Operating Area (SOA) and low RDS(on), and is ideally suited for hot swap, soft start and e-fuse applications. In order to manage the high in-rush current that can occur when swapping a server board or other pluggable system, or to ensure that a processor board is brought up smoothly, a MOSFET with high SOA is used in conjunction with a hot swap controller. Previous generation parts have traded off SOA against RDS(on), whereas the new technology maximizes SOA without affecting RDS(on), thereby maintaining high operating efficiency levels.
Nexperia’s new PSMN3R7-100BSE MOSFETs improve SOA with a four-fold improvement in linear mode
performance compared to standard technology, yet have a maximum RDS(on) of only 3.95 m (3.36 m typ.) – around 18% less than previous devices. These N-channel 100V devices are available in the D2PAK package, qualified to 175ºC. Devices are fully compatible with hot-swap controllers from all leading manufacturers
More information on the new PSMN3R7-100BSE NextPower Live linear-mode MOSFET, including product specs and datasheet is available at:
www.nexperia.com/products/mosfets/power-mosfets/
PSMN3R7-100BSE.html
Now at Mouser: Texas Instruments’ TPS7A10 ultra- low-dropout regulators for MCUs and analog sensors
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking TPS7A10 ultra-low-dropout regulators from Texas Instruments (TI). The TPS7A10 low-dropout (LDO) regulators feature an input range of 0.75 V to 3.3 V and fixed output voltage options between 0.6 V to 3.0 V, with high 1.5-percent accuracy over load, line, and temperature. The ultra-small 0.74 mm × 1.09 mm devices are suitable for space-constrained Internet of Things (IoT) devices, fitness trackers, smart watches, and medical devices, wireless headphones, and smartphones and tablets.
The TI TPS7A10 ultra-low-dropout regulators, available
from Mouser Electronics, offer ideal performance to support the lower core voltages of analog sensors and microcontrollers. The devices’ main power path (VIN) can connect to a power supply as low as 70 mV above than the output voltage, and an additional VBIAS rail enables support for very low input voltages. Both rails consume low quiescent currents of just 1.6 µA and 6 µA, respectively, providing an efficient solution for low-power performance. The TPS7A10 LDOs also boast a high power supply rejection ratio of 60 dB at 1 KHz.
The TPS7A10 regulators are supported by the TPS7A10EVM-004 evaluation module. Built to evaluate the operation and performance of the TPS7A10 LDO, the evaluation module offers a reference design for engineering applications requiring current of up to 300 mA.
To learn more, visit:
www.mouser.com/ti-tps7a10-regulators
Power Integrations launches 98.5%-efficient high voltage BLDC motor driver IC family
Appliance half-bridge motor driver eliminates heatsinks, slashes software certification time and expense
Power Integrations (Nasdaq: POWI), the leader in high- voltage integrated circuits for energy-efficient power conversion, today announced the release of its BridgeSwitch™ integrated half-bridge (IHB) motor driver IC family. BridgeSwitch ICs feature high- and low-side advanced FREDFETs (Fast Recovery Diode Field Effect Transistors) with integrated lossless current sensing, resulting in inverter conversion efficiency of up to 98.5% in brushless DC (BLDC) motor drive applications to 300 W. Superior efficiency along with the distributed thermal footprint provided by the IHB driver eliminates the need for a heatsink, reducing both system cost and weight. Integrated lossless current sensing, bus voltage sensing and system-level thermal sensing makes this device family ideal for BLDC motors in home-appliance applications. BridgeSwitch devices target refrigerator compressors, HVAC system fans and other residential and light commercial pumps, fans and blowers.
The 600 V FREDFETs used in BridgeSwitch ICs incorporate fast, ultra-soft-recovery body-diodes. This drastically reduces losses during switching and reduces noise generation, which simplifies system level EMC. The new high-voltage, self-powered, half-bridge motor driver ICs also feature built-in device protection and system monitoring and a robust single-wire status update interface which enables communication between the motor-microcontroller and up to three BridgeSwitch devices. Each BridgeSwitch device may be configured with different high- and low-side current limits, eliminating the need for the microcontroller and external circuitry to protect the system from open or shorted motor windings. Integrated loss-less current monitoring provides hardware-based motor fault protection, which simplifies the task of providing protection under motor-fault conditions to satisfy IEC60335-1 and IEC60730-1 requirements.
www.power.com
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