Front End I News
Kontron introduces COMe-cVR6 (E2) Module with new AMD Ryzen Embedded V1000 processor
K
ontron, a global provider of IoT/Embedded Computer Technology (ECT), introduces its new COMe-cVR6 (E2) Module in the COM Express Compact Type 6 form factor. It is based on the new AMD Ryzen Embedded V1000 processor, which sets the benchmark for high-end embedded computer modules. The COM Express Compact module's smaller form factor significantly saves space in comparison to most comparable solutions, allowing developers to create more compact designs with higher performance. Variants of the COMe-cVR6 (E2) are also resistant to vibration and shocks thanks to their permanently
soldered memory, just as all other components, such as voltage dividers, capacitors, and controllers are selected for highest resistance to environmental stresses. The new COM Express module is particularly suitable for applications in harsh environments, medical or industrial image processing systems, as well as complex automation systems. The new AMD Ryzen Embedded V1000 processors combine the extremely powerful "Zen" microprocessor architecture with the new AMD Radeon Vega graphics supporting up to 11 compute units. It offers up to twice the performance than the previous versions and delivers up to
46 per cent more multi-thread performance than competitive solutions. All in all, the new Accelerated Processing Unit (APU) with Zen CPU and Vega GPU achieve a performance throughput of up to 3.6 TFLOPS. The new APUs offer a comprehensive
feature set for data and application security. The built-in AMD Secure Processor handles hardware-accelerated data encryption and decryption. For secure virtualisation, Secure Encrypted Virtualisation (SEV) isolates the hypervisors and virtual machines without having to modify any of the code. The COMe-cVR6 (E2) offers a total of eight USB interfaces, two of which are
USB 3.1 Gen 2. By default, it offers five PCIe 3.0 Lanes, with the option of using one of these for a PCIe switch offering four PCIe 2.0 lanes on the COMe socket. Three independent display ports supplemented by LVDS or, optionally, eDP, cover a wide variety of image-intensive application scenarios through the resulting flexibility. Apart from other common interfaces such as SATA, I2C, and SMBus, two serial interfaces, a High Definition Audio Interface, and Gigabit Ethernet complete the feature set.
www.kontron.com
UltraSoC extends tools offering with integrated multi-core debug, visualisation and data science/analytics suite
U
ltraSoC has announced UltraDevelop 2, a complete integrated development
environment (IDE) that combines comprehensive debug, run control, and performance tuning with advanced visualisation and data science capabilities for system-on-chip (SoC) development teams. Incorporating technology from UltraSoC partners Imperas and Percepio, UltraDevelop 2 unleashes the potential of UltraSoC’s system-level on-chip monitoring and analytics infrastructure, providing actionable insights to dramatically cut development costs, shorten time-to- revenue and improve product quality. The new UltraDevelop tools suite delivers a holistic, system-level approach to SoC development and debug, allowing engineers to view and analyse the interlinked behaviour of hardware, firmware and software at any level of abstraction – and to interactively switch between views and tools depending on the task at hand. UltraSoC’s newly developed data science extensions offer advanced capabilities such as anomaly detection, heat mapping and root cause analysis. Visualisation capabilities based on Percepio’s Tracealyzer provide engineers with an integrated view of the operation of hardware and high-level software execution. The inclusion of
Imperas’ MPD debugger enables support for today’s multi-core, multi-threaded platforms, including devices that combine cores based on different CPU architectures into complex heterogeneous systems. Based on the industry-standard Eclipse platform, UltraDevelop 2 provides an integrated view that encompasses single step and breakpoint code execution status for multiple processors; instruction trace; and real-time, protocol aware monitoring of hardware structures within the SoC. Engineers can simultaneously view the behaviour of hardware structures such as memory controllers and interconnects / NoCs, and the execution of software, all across a number of different cores, even with different architectures. Designers working on simpler single-core debug tasks can access the same integrated debug capabilities, while utilising the open-source GDB debugger. “Today’s SoCs with heterogeneous multi-
core now being common, face the challenge of systemic complexity – and that is driving the ever-increasing cost of SoC design,” said Rich Wawrzyniak, principal analyst for ASIC & SoC at Semico Research Corp. “While simulation and emulation have progressed, integration and validation have not. Development teams are crying out for technologies that help them
UltraDevelop 2 presents SoC designers with actionable insights in a single window, utilising UltraSoC’s embedded analytics
manage that complexity, and that means giving them the capability to view their designs in real-time, interactively, and at just the level of detail they require. Tools that can view the SoC as a whole, not just in vendor silos, can have significant impact on engineering productivity and, in turn, on time-to-market and engineering cost. UltraSoC has been championing this for some time, and these new tools herald the
emergence of sophisticated ‘embedded analytics’ as a design capability which have the potential to make a serious positive impact on development team efficiency and mitigate spiralling SoC cost.” UltraDevelop 2 will be available to qualified customers in Q1 2019, with general availability shortly after.
www.ultrasoc.com
4 November 2018
Components in Electronics
www.cieonline.co.uk
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