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Advertorials Fischer Elektronik GmbH & Co. KG Advanced Interconnections


Constantly increasing power densities in electronics and power electronics require the use of efficient cooling methods in order to meet the component life specified by the manufacturer. The really big thermal power losses, e.g. for converters or switchgears, are often in the scale of a few kilowatts and are very effective to heat by means of high-


performance cooling aggregates. For this purpose Fischer Elektronik GmbH & Co. KG is expanding its extensive product portfolio of high-performance cooling aggregates by two more designs with the article number LA 34 in the dimensions (WxH) 80x83mm and LA 35 in the dimensions (WxH) 160x83mm. As it is usual for high-performance


Advanced Interconnections Corp. 5 Energy Way West Warwick, RI 02893 USA 401.823.5200 • 800.424.9850


Let Advanced design a solution for your next project from our extensive tool box of proven interconnect technology. We build from a solid foundation using screw-machined terminals and multi-finger contacts combined with a unique solder ball interface for surface mount applications that improve reliability across the board. Advanced offers technology, human resources and expertise that deliver the products you need at the exacting requirements and standards you expect. Our high-quality, reliable products


cooling aggregates the new designs are also available with an additional airflow chamber for generating a laminar air flow under the part numbers LAV 34 and LAV 35. Phone: +49 2351 435-0 info@fischerelektronik.de www.fischerelektronik.de


speak for themselves from commitment to quality. If you have a project need and you’re in the market for a reliable, experienced manufacturer, contact us today!


Lattice Radiant software tool accelerates system development for new Certus-NX FPGA-based designs


OKW’s New Smooth-Top SLIM-CASE


For Mobile Electronics OKW’s innovative and elegant new SLIM-CASE for mobile devices is now available in a smooth-top version for installing displays, push buttons and LEDs. Ergonomic SLIM-CASE (IP 54/65) is the new-generation handheld


enclosure for mobile measuring and control applications, wireless communications, IoT/IIoT, healthcare, laboratories, offices, safety engineering and environmental technology. SLIM-CASE underlines its aesthetic credentials with a virtually frameless, low-profile design and soft


HILLSBORO, OR – June 24, 2020 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of the latest version of its popular software design tool for FPGAs, Lattice Radiant™ 2.1. The version includes support for the company’s new general-purpose Lattice Certus™-NX FPGAs, the second family introduced within six months using Lattice Nexus™ FPGA development platform, plus native support for the SystemVerilog hardware description and verification language to increase functionality and design flexibility. Lattice Radiant design software accelerates development of Lattice FPGA-based applications for a range of markets, including industrial/automotive, communications/compute, and consumer. The new version of Radiant supports SystemVerilog throughout the entire design flow, from the native synthesis tool through the schematic viewer, hierarchical viewer, configuration wizards, and debugging tool. This highly productive coding method simplifies on-chip debugging and other tasks to streamline the design process and get Lattice FPGA-based products to market faster www.latticesemi.com


contours that enhance the ergonomics. There is plenty of space inside for PCBs, plug connectors, interfaces and sensors.


In addition to the smooth-top version, there is also a 1 mm recessed top for product labels or a 1.6 mm


recessed top for a touchscreen or membrane keypad. Each of the three variants can be specified with or without a soft-touch TPE intermediate ring for extra comfort and impact protection. This offers a choice of six versions in total. SLIM-CASE can accommodate inductive charging with the correct coil and NFC technology with Qi chargers. Power can be supplied by a flat battery mounted on the PCB. The enclosures are available in one plan size (M) – 148 x 74 mm – and two heights: 19 mm (without TPE ring) and 22 mm (with TPE ring). Inside there are PCB mounting pillars in both the top and base. SLIM-CASE is moulded from tough, UV-stable ASA+PC-FR (UL 94 V-0) for indoor and outdoor use. For


added security, the enclosures are assembled using tamperproof Torx T8 stainless steel screws. The cases’ standard colour is off-white (RAL 9002). Prices start at £19. OKW can supply SLIM-CASE fully customised. Services include custom colours for the main case and TPE ring, machining, lacquering, printing, laser marking, product labels, EMC shielding and installation/ assembly of accessories.


Visit the OKW website for more information: https://www.okw.co.uk/en/Plastic-enclosures/Slim-Case.htm


Contract Production continues to support British New Lattice Radiant 3.0 Design Software Further


manufacturing amidst pandemic uncertainty Yorkshire-based subcontract electronics manufacturer, Contract Production, has continued to enjoy record levels of growth, despite the uncertainty caused by the Coronavirus pandemic. The Pickering firm has attributed its busy production lines to a sharp uptake in onshore manufacturing and its robust supply chain, which it hopes will continue, restarting the fire of British manufacturing. With more than a decade’s experience working with some of the leading names in multiple industries, Contract Production are able to support businesses with a host of contract electronics services, including PCB assembly and testing, prototyping, box build, and BGA placement. With ISO 9001 accreditation and IPC certification, quality and precision are at the heart


Enhances Ease of Use to Accelerate FPGA Designs Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of the latest version of its popular software design tool for use with low power Lattice FPGAs, Lattice Radiant® 3.0. The tool supports higher density devices like the new Lattice CertusPro™-NX family – the latest family based on the Lattice Nexus™ platform – and offers new features that make it faster and easier than ever to develop Lattice FPGA-based designs. When system developers evaluate hardware platforms, the actual hardware is only a part of their


selection criteria. They also evaluate the design software used to configure the hardware for its ease of use and supported features, as those characteristics can have a significant impact on overall system development time and cost. “As a leading provider of FPGA-based SoM solutions for the industrial and automotive markets, we


of what Contract Production do. Partnered with industry-leading equipment and a commitment to traditional Yorkshire values of openness, honesty and integrity, Contract Production have become the manufacturing partner of choice of businesses across the UK. W: www.contract-production.co.uk E: sales@contract-production.co.uk T: 01751 475950


For more information about Lattice, please visit www.latticesemi.com 48 July/August 2020


www.cieonline.co.uk Components in Electronics


have decades of experience working with various software tools used in hardware development,” said Antti Lukats, CTO, Trenz Electronic GmbH. “The Lattice Radiant tool has a modern user interface that is highly intuitive and very easy to use, which reduces design complexity and helps us get products to market faster.” “Lattice Radiant 3.0 design software gives developers an easy-to-follow user experience; the tool leads


them through the steps of the development flow, including design creation, importing IP, implementation, bitstream generation, downloading the bitstream onto an FPGA, and debugging,” said Roger Do, Senior Product Line Manager, Software at Lattice Semiconductor. “Developers with little to no experience working with FPGAs can quickly leverage the automated features of Lattice Radiant. For experienced FPGA developers, Lattice Radiant 3.0 allows for more granular control over FPGA settings if specific optimizations are required.”


KONNEKTTM is a high-density package technology


interconnecting components without using metal frames - reducing ESR, ESL and thermal resistance of capacitors. The C0G has no DC bias, no piezo effect and show only


Advertorials


Advanced Interconnections Low profile, 1.0mm pitch Mezza-pede® SMT Connectors from Advanced Interconnections


feature screw-machined terminals in an over-molded insulator for superior performance and durability. Typical applications include tunable laser power, cable to board, and low profile board stacking. Available with customized options for automated assembly, in common and application-specific sizes.


High-efficiency ceramic capacitors of the KONNEKT™


Low profile - board to board stack height (z-axis) options ranging from 2.9mm to 4.0mm (nom.). Robust design features screw- machined terminals and multi-finger contacts with a per contact current rating of greater than 1 Amp at 80°C ambient. Dual row configurations include 8, 14, 20, 30, or 36 total positions with other pin counts available on a customized basis. Request a sample, watch a video, or build a part number online at www.advanced.com Advanced Interconnections Corp. USA Tel: 1 (401) 823-5200 Email: info@advanced.com www.advanced.com


minimal C-value change over temperature (+-30ppm/°C); particularly suitable when maximum efficiency is required. Available for temperatures up to 150°C, in the range of 14-880nF and voltages from 500 to 2000V. The U2J uses a Class I ceramic material with a


temperature coefficient N750 (-750+-120ppm/°C), extending the possible C-value range compared to C0G to 940nF and 1.4µF at voltage 50V. The X7R is designed for higher capacitance and voltage


requirements. The latest generation of sizes 1812 and 2220 also features flex termination. As a Class II component, it features minimal capacitance change (±15%) at an ambient temperature of -55°C to +125°C. Values range from 2.4nF up to 20µF and voltages are possible from 25V to 3000V.


Most parts are available in horizontal and vertical chip arrangement - the „low loss“ variant,


achieving further improvement in ESR/ESL values and making higher ripple currents possible. Predestined applications are e.g. WBG, SiC-/GaN-systems, Power Converters, Wireless Charging/ PV systems, Inverters, DC-Link and Snubber.


Contact details: Jürgen Geier, Technical Support Ceramic Capacitors at Rutronik +49 7231 801 1410 juergen.geier@rutronik.com


0.1°C accurate digital temperature sensor MMS Electronics can improve product temperature accuracy by using the Smartec SMT172


sensor. The SMT172 is a digital, factory calibrated, high accuracy temperature sensor with pulse width modulated output signal. PWM output sensors have high noise immunity and high reference accuracy. The sensors are easy to interface and multiplex. The duty cycle output of the SMT172 is proportional to the temperature. Accuracy of the TO18 sensor is 0.1ºC between -20ºC to 60ºC and 0.4ºC between -45 ºC and 130ºC. Maximum temperature is 130ºC. Supply voltage from 2.7 V to 5.5 V. This is the most energy efficient temperature sensor in the world with an average current of < 60uA or 220nA. Different sensor packages are available to suit the application including a 5mm and 7mm stainless steel probe with cable. For fast development evaluation boards with USB and I²C Interface are available (SMTAS04 and SMT172toI2C). Application are found in biotechnology, wearables, IOT, scientific, environmental and medical measurements. MMS Electronics Ltd Tel 01943 877668


Partnering with global suppliers to eradicate a common enemy


UK made: Pump maker buys Seaward


Smiths Interconnect is proud to be collaborating with leading medical technology organizations around the world to combat the ongoing COVID-19 pandemic. We’ve long been a trusted partner


to key ventilator manufacturers providing high reliability connectors renowned for their durability and unfaltering performance in critical environments.


production tester Sunderland-based Salamander Pumps has turned to Seaward Electronic of County Durham for production line test equipment. Salamander decided to move electrical safety testing into


post-assembly test while re-shaping its manufacturing operations to meet the needs of different pump types, some of which include electronics. The automated test solution it developed uses a Seaward


Currently our teams in Asia, the Americas and Europe are supporting programs to deliver connectors for ventilator production and delivery within those regions. These are products we’ve provided for many years including among others: KNB Series – a board-to-board


HAL 104 programmable tester to provide a suite of electrical safety tests and data traceability, integrated with a custom test jig with automated test connections.


When a pump assembly is located into the jig, pre-


configured codes automatically enable earth continuity and insulation tests, followed by a hipot (flash) test. Safety interlocks protect the operator. Automatic electrical testing is followed by pneumatic


connector with Hypertac® hyperboloid technology utilized within a French-made portable ventilator found in ambulances, ambulatory helicopters and hospitals. www.smithsinterconnect.com


testing to verify the integrity of the seals, then functional and performance testing. “We have worked with Salamander for a number of years,


and helping our customers integrate our products into bespoke production lines is a challenge that we are always happy to take on,” said Seaward application engineer Anthony Snowdon.


Find out more about the HAL Series at www.seaward.com/hal or call 0191 587 8736


Components in Electronics www.cieonline.co.uk July/August 2021 49 series from KEMET at Rutronik


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