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Aerospace, Military & Defence


Xilinx ‘Lifts Off’ with launch of 20nm space-grade FPGA


First to enable machine learning inference together with unlimited on-orbit reconfiguration for real time on-board-processing in space; delivers full radiation tolerance spanning all orbits


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ilinx has launched its 20-nanometer (nm) space-grade FPGA, delivering full radiation tolerance and ultra- high throughput and bandwidth


E-MAR16-030-E-TEC_Layout 1 10/03/2016 16:54 Page 1


performance for satellite and space applications. The new 20nm Radiation Tolerant (RT) Kintex UltraScale XQRKU060 FPGA provides true unlimited on-orbit reconfiguration, over a10x increase in digital signal processing (DSP) performance – ideal for payload applications – and full radiation tolerance across all orbits. The XQRKU060 also brings high performance machine learning (ML) to space for the first time. A diverse portfolio of ML development tools supporting industry standard frameworks, including TensorFlow and PyTorch, enable neural network inference acceleration for real-time on-board processing in space with a complete “process and analyse” solution. The XQRKU060’s dense, power-efficient compute with scalable precision and large on-chip


memory, provides 5.7 tera operations per second (TOPs) of peak INT8 performance optimised for deep learning, a nearly 25X increase compared to the prior generation. Building on Xilinx’s space heritage and 65nm space-grade devices, the launch of the first 20nm part for space applications advances the space industry by three process node generations. It delivers a significant reduction in size, weight and power, and is engineered with robust radiation tolerant features. The XQRKU060 provides customers with a space-resilient device equipped to handle both short and long duration missions in harsh space environments.


“With our extensive history in developing radiation tolerant technology and deploying this in reliable space-grade solutions, Xilinx continues its lead with the launch of the world’s most advanced process node for space,” says Minal Sawant, space systems architect, aerospace


Obsolete Chip?


E-tec offers a range of competitively priced package adaptors to solve obsolete package problems. These high quality adaptors are typically produced in 1.6mm thickness material or where the upper footprint interferes with the lower footprint then 2.4mm material is used. Here the pins are fitted into blind holes from below and the combination of a press fit and a solder fillet around the pin shoulder provides a reliable and robust connection.


Daughter boards can be created to customer requirements and raised pins are available to raise the complete assemble off the pcb to the required level.


E-tec welcomes special adaptor enquiries, send the chip package details for the top and bottom parts and we will respond promptly with a quotation.


and defense vertical marketing, at Xilinx. “The 20nm RT Kintex UltraScale FPGA is breaking industry standards and setting a new benchmark for meeting the high compute requirements of high bandwidth payloads, space exploration and research missions.”


Reconfigurable processing The XQRKU060 is the industry’s only true unlimited on-orbit reconfigurable solution. The on-orbit reconfiguration capabilities, together with real-time on-board processing and ML acceleration, allows satellites to update in real- time, deliver video-on-demand, and perform compute “on-the-fly” to process complex algorithms. The ML capabilities are suitable to a variety of problems spanning scientific analysis, object detection, and image classification – such as cloud detection – enabling improved processing efficiency and reduced decision latency both in space and on the ground.


As protocols and applications progressively change, the adaptive compute architecture of the XQRKU060 allows unlimited on-orbit reconfiguration to enable customers to perform last-minute product updates prior to launch, as well as after it has been deployed in orbit.


Resiliency for Space


The XQRKU060 offers rich DSP capabilities optimized for dense power-efficient compute. It is equipped with 2,760 UltraScale DSP slices and provides up to 1.6 TeraMACs of signal processing compute, more than a 10X increase compared to the prior generation, as well as dramatic efficiency gains for floating point computations. The increased compute capability in space is paired with massive I/O bandwidth from 32 high-speed transceivers (SerDes) that can run up to 12.5Gbps to deliver 400Gbps aggregate bandwidth. xilinx.com


t: 01892 530260 f: 01892 515560 e: info@e-tec.co.uk


www.cieonline.co.uk


www.e-tec.co.uk Components in Electronics July/August 2020 13


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