Supplement: Power
Connector contact degradation: 0.7 to 1.0 eV
Printed circuit boards (PCBs):
It’s important to note that these values are approximate and can vary based on the specifi c design, materials, manufacturing processes, and operating conditions of each component. Additionally, each component can have multiple failure mechanisms, each with its own Ea value.
temperature
Gallium arsenide (GaAs) devices: 0.8 to 1.0 eV
Integrated circuits (ICs): 0.6 to 1.2 eV (depending on the specifi c technology and failure mechanism)
Passive components: Ceramic capacitors: 0.8 to 1.1 eV
Electrolytic capacitors: 0.6 to 0.9 eV (The primary failure mechanism is often the evaporation of the electrolyte, which can be temperature sensitive.)
Film capacitors: 0.9 to 1.2 eV
Resistors: Carbon composition: 0.7 to 0.9 eV Metal fi lm: 0.8 to 1.0 eV Wirewound: 1.0 to 1.3 eV Inductors and transformers: 0.9 to 1.2 eV (primarily for insulation degradation)
Connectors and solder joints: Solder fatigue: 0.5 to 0.7 eV Electromigration in solder: 0.6 to 0.8 eV
To ensure the reliability of electronic systems, it’s imperative to manage and mitigate the effects of temperature. Some strategies include: Effective thermal design: Incorporating heat sinks, fans, and other cooling mechanisms can help dissipate heat effectively.
Component selection: Opting for components rated for higher temperatures or those designed for effi cient operation can reduce the overall thermal load.
Thermal monitoring and feedback: Modern electronic systems often incorporate sensors to monitor temperature, adjusting
system performance or triggering protective mechanisms if temperatures approach harmful levels.
At Relec Electronics, we provide a range of solutions and advice on thermal management, ensuring you choose the right components and design techniques for your applications.
The relationship between temperature and reliability in electronic systems is profound. As elucidated by the Arrhenius equation, even modest temperature increases can signifi cantly reduce the lifespan of critical components, particularly semiconductors. By understanding this relationship and implementing effective thermal management strategies, designers and engineers can ensure the longevity and optimal performance of electronic systems. If you’re facing challenges with thermal management or component selection, Relec Electronics is here to help. Our team of experts is ready to guide you in selecting the best solutions for your application. Contact us today to find out how we can support your projects.
https://www.relec.co.uk/
Custom Interconnect installs a 3rd volume auto SMT line with in-line 3d AOI at its BP2 facility.
CustomInterconnect installs a 3rd volume auto SMT line with in-line 3d AOI at its BP2 facility.
CIL now has a dedicated SMT line for prototyping, 4 off SMT lines for small – medium quantities and 3 off SMT lines for volume PCBA assembly. CIL has a unique UK position in offering the total PCBA solution. Prototype, small, medium and volume PCBA production as well as the UK’s largest Semiconductor packaging facility for SiC / GaN Power Electronics and Microelectronics development and production.
CIL now has a dedicated SMT line for prototyping, 4 off SMT lines for small – mediumquantities and 3 off SMT lines for volume PCBA assembly. CIL has a unique UK position in offering the total PCBA solution. Prototype, small, mediumand volume PCBA production as well as the UK’s largest Semiconductor packaging facility for SiC / GaN Power Electronics and Microelectronics development and production.
Weekly batch sizes now range from 1-5 off for prototypes, 5 -1000 off for small – medium volumes and 1000 –10,000 per week for volume.
Weekly batch sizes now range from1-5 off for prototypes, 5 -1000 off for small –mediumvolumes and 1000 –10,000 per week for volume.
www.cieonline.co.uk
Components in Electronics
December/January 2025 27
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