FEATURE PLCs, HMIs & Industrial PCs
Performance and power scaleability with compute and graphics processing
versatility for automation systems By Zeljko Loncaric, Marketing Engineer at congatec
AMD embedded solutions F
rom factory fl oor infrastructure to battery-powered portable devices, industrial control and automation systems are growing increasingly sophisticated, with exacting performance, power and thermal requirements. System designers are challenged to meet the diverse processing demands of graphics and compute-intensive systems, ranging from human-machine interfaces (HMIs) and machine-vision systems to industrial PCs, test and measurement equipment, robotics and factory automation. For graphics-driven applications, high-
resolution displays – to 4K – are increasing in demand, with processing performance to support 3D visualisation where needed, and multi-display operator panel confi gurability. Smart cameras, automated inspection and security/surveillance systems will require even more processing power to support advanced image detection and identifi cation applications. And as machine learning and artifi cial intelligence (AI) capabilities come to the fore with next-generation smart-factory automation infrastructure, high-speed parallel processing and multi-threading have emerged as critical necessities.
AMD to the rescue AMD Embedded Solutions provide an ideal processing platform to help increase the effi ciency, productivity and security of industrial process workfl ows. For designers seeking the combined
benefi ts of a CPU and GPU on a single die, AMD Ryzen Embedded V-Series SOCs are optimised for real-time control applications with demanding graphics and
22 May 2021 | Automation
AMD Ryzen
compute workloads. They off er advanced image processing, 3D visualisation and multi-axis motion control up to eight powerful cores based on the Zen micro architecture. AMD Embedded SOCs also support expansive multi-display confi gurations, with rich 4K graphics quality.
For designers seeking uncompromising compute performance, AMD EPYC Embedded 3000 processors harness the breakthrough performance-per-watt benefi ts off ered by the Zen architecture. System designers can exploit high-speed single-thread processing performance and/or multithread processing leveraging up to 16 cores to accelerate throughput for their unique application requirements.
Power efficiency
AMD Embedded Solutions processors support a wide range of thermal design profi les (TDPs). The latest AMD Ryzen V2000 processors off er even eight CPU core in a power envelope of as low as 10W, helping designers achieve the optimal performance per watt, minimising thermal constraints. Low-power AMD processors can also enable fanless, ventless system designs that prevent debris and particle ingress in harsh industrial environments, improving overall system reliability.
The Radeon Open eCosystem (ROCm) compute platform, based on the GPUOpen initiative, allows designers to achieve breakthrough innovations in GPU-driven imaging and parallel processing with open development tools and software. By balancing CPU and
AMD EPYC
GPU workloads for optimal processing performance, system designers can achieve advanced machine intelligence for next-generation factory automation systems. This feature is currently supported on select AMD Embedded Solutions, with additional support in progress.
Advanced security AMD Ryzen Embedded V1000, V2000 SOCs and AMD EPYC Embedded 3000 processors feature an independent on- chip AMD secure devices designed to enable secure hardware-validated boot, advanced capabilities including secure memory encryption (SME) for defending against unauthorised memory access, and secure encrypted virtualisation (SEV) for securely isolating hypervisors and virtual machines (VMs). Additionally, the AMD Ryzen Embedded V1000 family provides a one-time programmable (OTP) capability allowing customers to manage their own encryption keys. Moreover, these processors provide
robust, highly-integrated support for new and established interconnects, spanning PCIe, GbE, USB-C, SATA, eMMC 5.0 and NVMe, enabling myriad connectivity options. AMD Ryzen Embedded SOCs and EPYC Embedded 3000 processors support up to 16 and 64 PCIe lanes, respectively, for new levels of I/O versatility and device confi gurability.
CONTACT:
congatec
www.congatec.com
automationmagazine.co.uk
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