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• Nitrogen controlled environment • Relative humidity control • Real-time monitoring of temperature & humidity
• Secure cabinet and room controls • Stainless-steel dry boxes incorporating microprocessor control
• Pick & Place for individual die performed under Class 100 (ISO-5) hoods Our wafer stocks are either stored in
wafer form – known-good-die (KGD) fully tested from the original fabs with full die maps – or in die form. The tightly controlled nitrogen storage
provides almost unlimited storage life, with no deterioration. This means that really long-term customer delivery programmes can be guaranteed, with no appreciable changes in production yield. In parallel, Rochester’s unrivalled and
trusted long-term relationships with 70+ of the world leading Semiconductor manufacturers, allows for the transfer of the original assembly and test specifications after component discontinuation. Many of these manufacturers authorise Rochester to continue production, guaranteeing 100% identical parts and even allowing Rochester to use the original P/Nos. Increasingly, where future market
demand is visible, Rochester is funding the purchase of fully tested known- good-die for key “heart-beat” components at the core of our Customers most critical long-term Systems.
What happens if my IC package or a test platform is made obsolete? As with the wafer itself, package styles and the sub-components which go to make them up, are also subject to obsolescence. Rochester Electronics manages the long-term supply and availability of these elements, as well as long-term support of the assembly and test equipment, to ensure that supply is 100% risk-free. Rochester’s in-house packaging
capabilities (ceramic, metal-can, plastic DIP….) are supplemented by excellent relationships with other leading packaging companies, allowing Rochester to identify best-in-class sourcing for most historical packages.
Why would wafer storage and build be better than the traditional LTB purchase of Finished Goods? There are many benefits to the customer of authorised long-term production from wafer. The cash-flow for the businesses improve because a wafer/die reservation fee is significantly more economical than the upfront purchase of finished goods
for the complete project demand. The long-term storage costs are minimised because wafer storage is more economical than finished goods. The wafer storage and build offer guaranteed long-term
production yields which means that the purchase of an additional “safety factor %” is no longer required. Above all there are no quality/solderability risks because of the unpredictable deterioration finished goods. Examples of Rochester’s long-term post-EOL
Semiconductor production include, Intel ®’s 186/188/196/486 Processors, ADI’s Sharc & TigerSharc ®
ADSP-TS20* DSP’s, TI’s TMS320C3/4/5 & TMS320F240/206 DSP’s, Infineon/Cypress’s Dual-Port and FIFO SRAM’s, NXP’s 8-16Bit MCU’s 80C51 etc and Ampleon’s VDMOS / LDMOS Power FETs. Rochester is registered to
manufacture ITAR products and our process workflows include the
following certifications: • MIL-STD-883 TM5004 & 5005 for Levels B, Q, and V
• QML Certification to MIL-PR-38535 cage code (3V146)
“Carefully stored (and packaged)
components can normally provide 3-5 years of risk-free supply. Beyond that point, it is inevitable that yield-losses
(solderability issues) will rise, although specialist storage can mitigate some of
these risks. Unfortunately yield losses do not follow a linear trajectory and variations in plating type, plating
quality, package type, and lead-form, all have an impact on the diminishing usable life. The storage of finished
components is also costly, both in terms of the capital tied up, and the cost of special storage conditions.”
• In-house DLA lab certified for Group A, B, C, and D This means that Customers who
purchase from Rochester, can be 100% confident that components are Authorised and fully compliant with the original Supplier’s specification, not only fit-form-function but also errata/software compliant as well. No further testing or qualification is required. With Rochester’s completely
authorised in-house: Wafer Storage & Processing; IC Packaging, Test Support Services, and Component Qualification, Customers now have the option to extend service-lives and/or avoid expensive System re-designs.
Rochester Electronics
www.rocelec.com
/ ELECTRONICS
ELECTRONICS | SEPTEMBER 2020
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