EMBEDDED SYSTEMS
they do no block areas like conveyor systems. They move along pre-programmed routes that optimise warehousing, transport, and other tasks. When used with mobile pick & place robots, integration with VGR systems is the result.
Modularity plays a crucial role Advanced mobile robotic systems may require additional subsystems. A good case to highlight is a robot that was constructed with four legs and featured a total of three Computer-on-Modules. Each module performed a specific task – locational awareness, motion control and task fulfilment. This example demonstrates the advantageous use of Computer-on-Modules, which can be easily scaled for each specific task. Controls could also be combined within a single system for communication with the drives’ actuators/ frequency inverters in real-time using a two-wire Ethernet, although modules with significantly more power on a time-proven platform strategy would be required. It should be noted that all in all 10 processor cores on 3 modules, which have not been introduced on the market for ultra low-power mobile embedded systems, were used in this example to deliver the required computing power and ensure real time operation.
BCON for MIPI allows for trouble-free connection of cameras
generation COM-HPC modules utilising 11th generation Intel Core processor technology (Tiger Lake U and Tiger Lake H) are preferred. Their standout attributes include providing PCIe Gen 4 with twice as much bandwidth between processors and cameras, as well as discrete GPUs, compared to PCIe Gen3. Native support of MIPI-CSI cameras also provides two main benefits – reduction of processing requirements and the need for investments in camera technology. Customisable connections of 1GbE and 2x 2.5GbE (with TSN) Ethernet options to dual 10GbE, which come with congatec’s COM-HPC starter set, are compatible with the modules. Interfacing with smaller devices, such as actuators and sensors, is therefore possible if two- wire Ethernet is used.
A three level training kit, based on congatec Computer-on-Modules, was created by the Autonomous System Lab at Intel Labs China
Supercharging with higher core counts COM-HPC modules that eclipse current COM Express module performance with substantially more interfaces, bandwidth, memory and cores are starting to become available after the PICMG standardisation committee ratified the COM-HPC Computer-on- Module specification. This is true for COM-HPC client modules, but affects the server category even more, as future solderable entry class COM-HPC server modules will be more durable and scalable, allowing for consolidation of decentralised real-time control systems in multi-purpose embedded edge computer solutions. Hypervisors from manufacturers like Real-Time Systems would be required for virtual machines capable of real-time operation. Real-time hypervisor solutions are required for uninterrupted, deterministic real-time control, regardless of rebooting on the same HMI processor of the production cell or the evaluation and conversion or data or processing of tasks in parallel by the integrated loT gateway.
A growing hunger for higher performance Processor hungry 3D imaging needs the power of COM-HPC. Just consider the creation of point clouds acquired by time-of-flight (ToF) technology, which outputs 32 bits of spatial coordinates for each pixel. A resolution of 640 x 480 pixels at 30 frames per second (fps) therefore produces 35MB of 3D data per second. On top of this the colour information of a classic 2D camera, with generally 4 times higher resolutions has to be processed as well. At 1.2 mega pixels (1280 x 1024 pixels) and 8-bit colour depth per channel, we are talking about an additional 112.5MByte per second. These result in up to around 150 megabytes of data that is to be processed per second, not to mention the excessive processing power required for two cameras operating in stereo. Since the amount of data and CPU/GPGPU computing power are extremely demanding, first
Keeping AI firmly in the mix congatec has ensured additional plug-and-play friendliness with IIoT and Industry 4.0 networked embedded systems by providing extensive AI compatibility with cameras connected by MIPI-CSI. Intel DL Boost based vector neural network instructions (VNNI) and 8-bit integer instructions (Int8) can be implemented on the GPU for AI and inference acceleration. Compatibility with the Intel Open Vino ecosystem for AI should also be mentioned. A COM Express based platform for training purposes, together with a “Ready for Production” kit certified by Intel for workload consolidation, have already been introduced by the Autonomous System Lab of Intel Labs China. With this HERO platform, engineers can now evaluate this OpenVINO ecosystem from the software libraries to Adaptive Human-Robot Interaction (AHRI) or Simultaneous Localisation & Navigation (SLAM). Smart vision robotics and autonomous logistics vehicles can be
also evaluated by the ATX carrier board conga-HPC/EVAL-Client. It comes with two high performance PCIe Gen4 x16 interfaces and many LAN options for data bandwidth, transmission, and connectors. Mezzanine cards allow the carrier to run up to two 25GbE interfaces. The conga-HPC/cTLU Computer-on-Module is the main component of the starter kit presented for COM-HPC Client designs. Three processor configurations are available, with three cooling solutions to go with the configurable 12 to 28 W TPD range of the 11th generation Intel Core processors.
congatec
congatec.com
Computer-on-Modules from congatec are compatible with Real-Time Systems’ real-time hypervisor technology for combining multiple edge applications in a single system
NOVEMBER 2021 | ELECTRONICS TODAY 29
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46
