CONTRACT MANUFACTURING


Optimising wafer


inspection with advanced


Figure 1: The Olympus MX63L microscope is equipped with a large stage to accommodate wafers as large as 300 mm (11.8in)


microscopy and image analysis


Dr. Sergej Bock & Dr. Norbert Radomski, solution managers in the global Customised Solutions Group at Olympus Soft Imaging Solutions in Germany focus on the substantial time savings that can be achieved by using the right microscopy system, paired with the right metrology image analysis program during the inspection


W


ith the ongoing semiconductor chip shortage affecting the supply of cars, phones, and other electronics, manufacturers are looking for ways to improve all parts of their process - including wafer inspection quality control. One easy way to do this is by using the right combination of equipment. Specifi cally, the right microscopy system paired with the right metrology image analysis program can save a substantial amount of time during the inspection process. Wafer manufacturing is a complex process that includes circuit creation, wafer oxidization, photoresist coating, pattern printing, etching, impurity diffusion, and planarization. Defects can be introduced into the fi nal products at any of these stages. Commonly seen defects include irregular coatings, broken circuits, fl aws, and impurities. Since defects can prevent the electric circuit from functioning properly, wafer inspection is a critical step to ensure product quality in the manufacturing process. With defects at the micrometer scale, optical microscopes are often used for nondestructive wafer inspection. Users should be able to clearly view the sample surface with various observation methods and objective lenses, as well as easily document results for further analysis or future reference.


Wafer Inspection With the current semiconductor chip 32 MARCH 2022 | ELECTRONICS TODAY


Figure 2: (a left) Example CAD drawing of a wafer, and (b below), images captured using an OLYMPUS MX microscope and OLYMPUS Stream image analysis software at the locations defi ned in image (a left)


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