COVER STORY
The Impressive Nano-D Connector
Small, lightweight, and known for its high-reliability performance, the Nano-D connector is taking the lead in ruggedised portable electronics.
N
ew charge-coupled device (CCD) and enhancement mode gallium nitride (eGaN) circuits offer significantly higher signal and switching speeds in smaller, lightweight designs that operate on very low voltages and demand very little current. Existing silicon chip designs will continue to serve in many of our devices, but we are starting to see older CCDs being eclipsed by the new ones due to their faster processing capabilities. For instance, newer high-sensitivity backlit CCDs are being used for night vision technologies and photon sensors in LiDAR (light detection and ranging) equipment offer totally new dimensions in surveillance. These devices and the modern chip technology that makes them possible impact circuit board designs as well as connector and cable selections. They are fueling the demand for miniaturisation at lower voltages and current levels. As such, nano-D connectors serve design engineers well in this new era. Nano-D connectors are designed to perform at military specification levels for high reliability and to remain working in both portable applications and extreme environments. Most Nano-D connectors evolved rather directly from the older Micro-D connectors and follow similar specifications. Nano-D connector designs often use a 17,200ksi beryllium copper spring-pin-to-solid-socket design to ensure signal integrity during use. As speeds go up, the wavelength of each signal is shorter, and at lower voltages, vibration and circuit noise could confuse the signal. Nano-D connector resistance is kept as low as 12 to 15 milliohms with a capacitance of 2.0pf to 2.4pf, which is ideal for most circuits with low current flow and low voltage. With increasing speeds, capacitive coupling is also controlled by adjusting the connector insulator spacing to match the specific needs of the application. Low-skew cable technology is evolving to match cable performance to the needs of higher switching and signal speed interconnects. Omnetics Nano-D and Micro-D connectors offer SWaP advantages in small-scale ruggedized applications.
Nano-D connectors have also matched the explosive growth of cube satellites and other small satellites being launched into controlled
12 MARCH 2022 | ELECTRONICS TODAY
orbits. These satellites are kept in a constant altitude position as they travel in orbit to keep focused on the Earth and also communicate with one another. Satellite construction format uses electrically interconnected stacked and standardised printed circuit boards, and Nano-D connectors are often chosen for these systems because of their format and size, and because many are designed with low outgassing materials specifically tested by NASA.
Phased-array radar techniques, photonic emission radar, and LiDAR systems are also evolving rapidly. Phased-array radar uses the principle of creating multiple points-of-source to direct the pulsed signal beam. The return signal yields a point-of-focus image instead of the large area or circle image produced in the past. Since there are many points and phase changes in each adjacent emission position of the phased radar, these systems require many pin connections from the edge of the radar transmit card to the focal beam circuit. As such, small, rugged, high-pin-count Nano-D connectors are often used on the edge of the circuit boards.
LiDAR surveillance systems use similar interconnections to trigger resonance- enhanced multiphase ionisation (REMPI) within an area being scanned. One major benefit of this technology is that hydrocarbon field studies can be analysed from surveillance planes and satellites to map and reduce the cost and risk in petroleum exploration. REMPI uses a tunable laser to form a plasma beam, and high-pin-count connectors and cable are
used to help set and focus the beam. The new photoemission radar systems demand similar high-pin-count connectors.
Connectors for space technology use only low outgassing polymers, but also include PTFE (polytetrafluoroethylene) insulated wire and cable certified to MIL-16878/4200°C. Wiring is connected to pins and sockets using high- pressure crimping technology to eliminate the potential problems of soldered leads coming into the back of the connector. When required, full specification RoHS-compliant assemblies are also available. Mixed-signal Nano-D connectors that include separate sections for power and signal processing within a single connector housing are also available and can significantly reduce the number of cables being routed to and from an instrument. Portable high-speed digital signal processing devices are also expanding the demand for small, lightweight cable and connectors. Nano-D connectors are especially well suited for these ruggedised, environmentally sensitive applications. When specified, cable, signal- speed capability, and formats are designed to match the ultra-small Nano-D connectors. Designs include IEEE 1394 fire-wire cable and extend to USB 3.1 formats and CAT 6a wiring. Many of these formats support a wide range of new designs, ranging from circuitry used in small military unmanned vehicles to soldier- worn equipment.
Omnetics
http://www.omnetics.com
sales@omnetics.com
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