WEARABLE TECHNOLOGY & BIOMETRICS
Power Management Units (PMU), Dynamic Voltage & Frequency Scaling (DVFS) techniques as well as extensive clock and power gating depending upon system requirements. This adds further to the modes in order to help the system architect – usually light sleep, deep sleep and shutdown modes are regarded as normal varying recovery times to return to normal operation depending upon mode. However, from the system perspective where delivering every ounce of power saving is critical, such a coarse grain approach to SRAM power saving often means spending order to deliver the lowest operating power EverOn provides the system architect with much greater granularity of control as
EverOn instances have four independently controllable banks – each being capable of being active, asleep (data retained) or shut down (powered off, no retention). In addition, the periphery is also independently
Horizon mems packaging applications T
he market for MEMS devices is growing rapidly, due to the many advantages that these devices offer, such as their small size, low power consumption, and high reliability. One of the main reasons for the growth of the MEMS market is the increasing demand for miniaturization. As electronic devices continue to shrink in size, MEMS devices are becoming more attractive due to their small dimensions, and with the ongoing trend towards wearable electronics, there is a growing need for even smaller and more versatile MEMS devices.
Andreas Frölich, CEO at Horizon says, “MEMS devices are also in electronic systems. With the ever-growing range of applications that MEMS are considered for, there is also a growing need for components that can withstand harsh environments or extreme need housings for a variety of reasons, and these housing are an essential part of the system since they constitute the interface of the actual MEMS to the rest of the device and the rest of the world.”
controllable, either active, in light sleep (1 cycle wakeup), deep sleep (power supply drooped to cut leakage) or in full shutdown. Such granularity of control means system architects are no longer bound by the imposition of having to put the entire memory into one of several sleep modes. management challenges.
SureCore has invested considerable
is production ready including an extensive corner silicon validation and successful completion of life tests. Access to the compiler is via a web-based interface which generates the standard EDA model suite as well as product datasheets.
sureCore Limited
www.sure-core.com
Horizon offers an in-house post-build coating technology that augments the opportunities afforded through the use of micro-AM produced MEMS packaging by adding functionality, conductivity, once the part is produced on a polymer-AM platform, it is either wholly or selectively coated with a conductive layer. narrow channel and undercuts. In addition, microfabricated 3D templates can also be coated with metal-oxides to make parts compatible with aggressive chemical environments and in some cases can notably increase the resistance to high temperatures and mechanical stresses.
Frölich continues, “While additive manufacturing is not typically considered a mass-production technology, the reduction in the size of electronics and optics — and the accompanying shrinkage of packaging — has made micro-AM a viable production alternative for MEMS housings for small to medium batch sizes. In addition to the precision offered by micro-AM, and the ability to build geometrically complex housings, an intelligent use of our post-processes can increase the functionality of the packaging, for example by reducing stray light in the infrared, having integrated electrical conductors, or making an off-the-shelf MEMS system usable in a harsh environment by adapting the right packaging.”
Horizon
www.3dmicrofabrication.com | 39
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46
